DSA557-0334FI1VAO
ActiveDUAL-OUTPUT PCIE CLOCK GEN FOR AUTOMOTIVE
Deep-Dive with AI
Search across all available documentation for this part.
DSA557-0334FI1VAO
ActiveDUAL-OUTPUT PCIE CLOCK GEN FOR AUTOMOTIVE
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | DSA557-0334FI1VAO |
|---|---|
| Differential - Input:Output | No/Yes |
| Main Purpose | PCI Express (PCIe) |
| Mounting Type | Surface Mount |
| Number of Circuits | 1 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Output | LVDS, HCSL |
| Package / Case | 14-VFQFN Exposed Pad |
| PLL | True |
| Ratio - Input:Output [custom] | 1:2 |
| Supplier Device Package | 14-QFN (2.5x3.2) |
| Voltage - Supply [Max] | 3.63 V |
| Voltage - Supply [Min] | 2.25 V |
DSA557-03 Series
Dual-output PCIe Clock Gen for Automotive
| Part | Operating Temperature [Max] | Operating Temperature [Min] | PLL | Differential - Input:Output | Main Purpose | Package / Case | Voltage - Supply [Max] | Voltage - Supply [Min] | Supplier Device Package | Ratio - Input:Output [custom] | Mounting Type | Number of Circuits | Output |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Microchip Technology | 85 °C | -40 °C | No/Yes | PCI Express (PCIe) | 14-VFQFN Exposed Pad | 3.63 V | 2.25 V | 14-QFN (2.5x3.2) | 1:2 | Surface Mount | 1 | HCSL LVCMOS LVDS | |
Microchip Technology | 105 °C | -40 °C | No/Yes | PCI Express (PCIe) | 14-VFQFN Exposed Pad | 3.63 V | 2.25 V | 14-QFN (2.5x3.2) | 1:2 | Surface Mount | 1 | HCSL | |
Microchip Technology | 85 °C | -40 °C | No/Yes | PCI Express (PCIe) | 14-VFQFN Exposed Pad | 3.63 V | 2.25 V | 14-QFN (2.5x3.2) | 1:2 | Surface Mount | 1 | HCSL LVDS | |
Microchip Technology | 85 °C | -40 °C | No/Yes | PCI Express (PCIe) | 14-VFQFN Exposed Pad | 3.63 V | 2.25 V | 14-QFN (2.5x3.2) | 1:2 | Surface Mount | 1 | HCSL LVCMOS LVDS | |
Microchip Technology | 85 °C | -40 °C | No/Yes | PCI Express (PCIe) | 14-VFQFN Exposed Pad | 3.63 V | 2.25 V | 14-QFN (2.5x3.2) | 1:2 | Surface Mount | 1 | HCSL LVDS | |
Microchip Technology | 105 °C | -40 °C | No/Yes | PCI Express (PCIe) | 14-VFQFN Exposed Pad | 3.63 V | 2.25 V | 14-QFN (2.5x3.2) | 1:2 | Surface Mount | 1 | HCSL LVCMOS LVDS | |
Microchip Technology | 85 °C | -40 °C | No/Yes | PCI Express (PCIe) | 14-VFQFN Exposed Pad | 3.63 V | 2.25 V | 14-QFN (2.5x3.2) | 1:2 | Surface Mount | 1 | HCSL LVCMOS LVDS | |
Microchip Technology | 105 °C | -40 °C | No/Yes | PCI Express (PCIe) | 14-VFQFN Exposed Pad | 3.63 V | 2.25 V | 14-QFN (2.5x3.2) | 1:2 | Surface Mount | 1 | HCSL LVCMOS LVDS | |
Microchip Technology | 105 °C | -40 °C | No/Yes | PCI Express (PCIe) | 14-VFQFN Exposed Pad | 3.63 V | 2.25 V | 14-QFN (2.5x3.2) | 1:2 | Surface Mount | 1 | HCSL | |
Microchip Technology | 105 °C | -40 °C | No/Yes | PCI Express (PCIe) | 14-VFQFN Exposed Pad | 3.63 V | 2.25 V | 14-QFN (2.5x3.2) | 1:2 | Surface Mount | 1 | HCSL LVCMOS LVDS |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Microchip Direct | TUBE | 1 | $ 4.07 | |
| 25 | $ 3.40 | |||
| 100 | $ 3.09 | |||
| 1000 | $ 2.98 | |||
| 5000 | $ 2.95 | |||
Description
General part information
DSA557-03 Series
The DSA557-03 is an automotive grade crystal-less, 2-output PCI express clock generator meeting Gen1, Gen2, Gen3 and Gen4 specifications. The clock generator uses proven silicon MEMS technology to provide 100MHz differential output clocks with excellent jitter and stability over a wide range of supply voltages and automotive grade 2 ( -40°C to 105°C) temperature range. By eliminating the external quartz crystal, the DSA557-03 significantly enhances reliability and accelerates product development, while meeting stringent clock performance criteria for a variety of automotive applications. DSA557-03 has an Output Enable/Disable feature allowing it to disable the outputs when OE pin is low. The device is a space saving 14 pin QFN package.
Documents
Technical documentation and resources