
STB55NF06LT4
ActivePOWER MOSFET, N CHANNEL, 30 V, 55 A, 0.014 OHM, TO-263 (D2PAK), SURFACE MOUNT
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STB55NF06LT4
ActivePOWER MOSFET, N CHANNEL, 30 V, 55 A, 0.014 OHM, TO-263 (D2PAK), SURFACE MOUNT
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Technical Specifications
Parameters and characteristics for this part
| Specification | STB55NF06LT4 |
|---|---|
| Current - Continuous Drain (Id) @ 25°C | 55 A |
| Drain to Source Voltage (Vdss) | 60 V |
| Drive Voltage (Max Rds On, Min Rds On) | 10 V, 5 V |
| Drive Voltage (Max Rds On, Min Rds On) [Max] | 10 V |
| Drive Voltage (Max Rds On, Min Rds On) [Min] | 5 V |
| FET Type | N-Channel |
| Gate Charge (Qg) (Max) @ Vgs | 37 nC |
| Input Capacitance (Ciss) (Max) @ Vds | 1700 pF |
| Mounting Type | Surface Mount |
| Operating Temperature [Max] | 175 °C |
| Operating Temperature [Min] | -55 °C |
| Package / Case | D2PAK (2 Leads + Tab), TO-263-3, TO-263AB |
| Power Dissipation (Max) | 95 W |
| Rds On (Max) @ Id, Vgs | 18 mOhm |
| Supplier Device Package | D2PAK |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 16 V |
| Vgs(th) (Max) @ Id [Max] | 4.7 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Arrow | N/A | 1000 | $ 0.74 | |
| 2000 | $ 0.69 | |||
| Digikey | Cut Tape (CT) | 1 | $ 1.79 | |
| 10 | $ 1.49 | |||
| 100 | $ 1.18 | |||
| 500 | $ 1.00 | |||
| Digi-Reel® | 1 | $ 1.79 | ||
| 10 | $ 1.49 | |||
| 100 | $ 1.18 | |||
| 500 | $ 1.00 | |||
| N/A | 886 | $ 2.20 | ||
| Tape & Reel (TR) | 1000 | $ 0.85 | ||
| 2000 | $ 0.81 | |||
| 5000 | $ 0.78 | |||
| 10000 | $ 0.75 | |||
| Newark | Each (Supplied on Cut Tape) | 1 | $ 2.58 | |
| 10 | $ 1.84 | |||
| 25 | $ 1.71 | |||
| 50 | $ 1.57 | |||
| 100 | $ 1.44 | |||
| 250 | $ 1.40 | |||
| 500 | $ 1.22 | |||
| 1000 | $ 1.14 | |||
Description
General part information
STB55 Series
This Power MOSFET is the latest development of STMicroelectronis unique Single Feature Size" strip-based process. The resulting transistor shows extremely high packing density for low onresistance, rugged avalanche characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility."Exceptional dv/dt capability100% avalanche testedApplication oriented characterization
Documents
Technical documentation and resources