Integrated Circuits (ICs)

TE0745-02-72I11-A

Obsolete

SOM 1GB DDR3 XC7Z030-2FBG676I

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Integrated Circuits (ICs)

Obsolete

SOM 1GB DDR3 XC7Z030-2FBG676I

Technical Specifications

Parameters and characteristics for this part

Part	RAM Size	Module/Board Type	Flash Size	Operating Temperature [Max]	Operating Temperature [Min]	Connector Type	Core Processor	Size / Dimension [x]	Size / Dimension [y]	Size / Dimension [y]	Size / Dimension [x]	For Use With/Related Products	Suggested Programming Environment	Contents	Utilized IC / Part	Platform	Co-Processor
Trenz Electronic TE0745-02-91C11-A	1 GB	MPU Core	64 MB	70 °C	0 °C	Samtec ST5	Xilinx Zynq XC7Z045-1FBG676C	52 mm	2.99 in	76 mm	2.05 in
Trenz Electronic TE0745-02-72I11-A	1 GB	MPU Core	64 MB	85 °C	-40 C	Samtec ST5	Xilinx Zynq XC7Z030-2FBG676I	52 mm	2.99 in	76 mm	2.05 in
Trenz Electronic TE0745-02-92I11-A
Trenz Electronic TEB0745-02												TE0745	Vivado	Board(s)	TE0745	TE0745 Zynq-7000 AP SoC Carrier
Trenz Electronic TE0745-02-81C11-A	1 GB	FPGA MCU	32 MB	85 °C	-40 C	Samtec ST5	ARM® Cortex®-A9	52 mm	2.99 in	76 mm	2.05 in						Zynq-7000 (Z-7035)
Trenz Electronic TE0745-02-71I11-A	1 GB	FPGA MCU	64 MB	85 °C	-40 C	Samtec ST5	ARM® Cortex®-A9	52 mm	2.99 in	76 mm	2.05 in						Zynq-7000 (Z-7030)

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	0	$ 0.00

General part information

TE0745 Embedded Module Xilinx Zynq XC7Z030-2FBG676I 1GB 64MB

Technical documentation and resources