TE0745 Series
Manufacturer: Trenz Electronic
SOM 1GB DDR3 XC7Z045-1FBG676C
| Part | RAM Size | Module/Board Type | Flash Size | Operating Temperature [Max] | Operating Temperature [Min] | Connector Type | Core Processor | Size / Dimension [x] | Size / Dimension [y] | Size / Dimension [y] | Size / Dimension [x] | For Use With/Related Products | Suggested Programming Environment | Contents | Utilized IC / Part | Platform | Co-Processor |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Trenz Electronic | 1 GB | MPU Core | 64 MB | 70 °C | 0 °C | Samtec ST5 | Xilinx Zynq XC7Z045-1FBG676C | 52 mm | 2.99 in | 76 mm | 2.05 in | ||||||
Trenz Electronic | 1 GB | MPU Core | 64 MB | 85 °C | -40 C | Samtec ST5 | Xilinx Zynq XC7Z030-2FBG676I | 52 mm | 2.99 in | 76 mm | 2.05 in | ||||||
Trenz Electronic | |||||||||||||||||
Trenz Electronic | TE0745 | Vivado | Board(s) | TE0745 | TE0745 Zynq-7000 AP SoC Carrier | ||||||||||||
Trenz Electronic | 1 GB | FPGA MCU | 32 MB | 85 °C | -40 C | Samtec ST5 | ARM® Cortex®-A9 | 52 mm | 2.99 in | 76 mm | 2.05 in | Zynq-7000 (Z-7035) | |||||
Trenz Electronic | 1 GB | FPGA MCU | 64 MB | 85 °C | -40 C | Samtec ST5 | ARM® Cortex®-A9 | 52 mm | 2.99 in | 76 mm | 2.05 in | Zynq-7000 (Z-7030) |