Soldering, Desoldering, Rework Products

NC191LT10

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Chip Quik Inc.

SMOOTH FLOW LOW TEMP SOLDER PAST

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Soldering, Desoldering, Rework Products

NC191LT10

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Chip Quik Inc.

SMOOTH FLOW LOW TEMP SOLDER PAST

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Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	NC191LT10

Composition	57.6 %, 42 %, 0.4 %
Flux Type	No-Clean
Form	10 g, 0.35 oz, 5 ml
Form	Syringe
Melting Point	280 °F
Melting Point	138 °C
Mesh Type	4
Shelf Life	6 Months
Shelf Life Start	Date of Manufacture
Shipping Info	Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Type	Solder Paste

NC191 Series

Part	Mesh Type	Type	Form	Form	Form	Melting Point	Melting Point	Flux Type	Shelf Life	Composition	Shelf Life Start	Mesh Type	Shelf Life	Storage/Refrigeration Temperature [Max]	Storage/Refrigeration Temperature [Min]	Storage/Refrigeration Temperature [Min]	Storage/Refrigeration Temperature [Max]	Process	Melting Point [Max]	Melting Point [Max]	Melting Point [Min]	Melting Point [Min]	Composition	Shipping Info	Composition
Chip Quik Inc. NC191LT35	4	Solder Paste	1.23 oz 10 cc	35 g	Syringe	280 °F	138 °C	No-Clean	6 Months	0.4 % 42 % 57.6 %	Date of Manufacture
Chip Quik Inc. NC191LT250T5		Solder Paste	8.8 oz	250 g	Jar	280 °F	138 °C	No-Clean	6 Months	0.4 % 42 % 57.6 %	Date of Manufacture	5
Chip Quik Inc. NC191-2CC6		Flux - No Clean	0.07 oz 2 cc	2 g	Tube						Date of Manufacture		24 Months	77 °F	3 °C	37 °F	25 °C
Chip Quik Inc. NC191AX250T5		Solder Paste	8.8 oz	250 g	Jar	361 °F		No-Clean			Date of Manufacture	5	12 Months					Leaded
Chip Quik Inc. NC191AX35	4	Solder Paste	1.23 oz 10 cc	35 g	Syringe	361 °F		No-Clean			Date of Manufacture		12 Months					Leaded
Chip Quik Inc. NC191SNL50T5		Solder Paste	1.76 oz	50 g	Jar			No-Clean	6 Months		Date of Manufacture	5							220 °C	428 °F	422 °F	217 °C	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Chip Quik Inc. NC191SNL250	4	Solder Paste	8.8 oz	250 g	Jar			No-Clean	6 Months		Date of Manufacture								220 °C	428 °F	422 °F	217 °C	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Chip Quik Inc. NC191LT10	4	Solder Paste	0.35 oz 5 ml 10 g		Syringe	280 °F	138 °C	No-Clean	6 Months	0.4 % 42 % 57.6 %	Date of Manufacture													Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended.
Chip Quik Inc. NC191SNL35	4	Solder Paste	1.23 oz 10 cc	35 g	Syringe			No-Clean	6 Months		Date of Manufacture								220 °C	428 °F	422 °F	217 °C	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Chip Quik Inc. NC191LTA50T5		Solder Paste	1.76 oz	50 g	Jar	279 °F	137 °C	No-Clean			Date of Manufacture	5	12 Months										Bi57Sn42Ag1		57/42/1