NC191 Series
Manufacturer: Chip Quik Inc.
Beta
⌘K
SMOOTH FLOW LOW TEMP SOLDER PAST
| Part | Mesh Type | Type | Form | Form | Form | Melting Point | Melting Point | Flux Type | Shelf Life | Composition | Shelf Life Start | Mesh Type | Shelf Life | Storage/Refrigeration Temperature [Max] | Storage/Refrigeration Temperature [Min] | Storage/Refrigeration Temperature [Min] | Storage/Refrigeration Temperature [Max] | Process | Melting Point [Max] | Melting Point [Max] | Melting Point [Min] | Melting Point [Min] | Composition | Shipping Info | Composition |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Chip Quik Inc. | 4 | Solder Paste | 1.23 oz 10 cc | 35 g | Syringe | 280 °F | 138 °C | No-Clean | 6 Months | 0.4 % 42 % 57.6 % | Date of Manufacture | ||||||||||||||
 Chip Quik Inc. | Solder Paste | 8.8 oz | 250 g | Jar | 280 °F | 138 °C | No-Clean | 6 Months | 0.4 % 42 % 57.6 % | Date of Manufacture | 5 | ||||||||||||||
 Chip Quik Inc. | Flux - No Clean | 0.07 oz 2 cc | 2 g | Tube | Date of Manufacture | 24 Months | 77 °F | 3 °C | 37 °F | 25 °C | |||||||||||||||
 Chip Quik Inc. | Solder Paste | 8.8 oz | 250 g | Jar | 361 °F | No-Clean | Date of Manufacture | 5 | 12 Months | Leaded | |||||||||||||||
 Chip Quik Inc. | 4 | Solder Paste | 1.23 oz 10 cc | 35 g | Syringe | 361 °F | No-Clean | Date of Manufacture | 12 Months | Leaded | |||||||||||||||
 Chip Quik Inc. | Solder Paste | 1.76 oz | 50 g | Jar | No-Clean | 6 Months | Date of Manufacture | 5 | 220 °C | 428 °F | 422 °F | 217 °C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | ||||||||||||
 Chip Quik Inc. | 4 | Solder Paste | 8.8 oz | 250 g | Jar | No-Clean | 6 Months | Date of Manufacture | 220 °C | 428 °F | 422 °F | 217 °C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | ||||||||||||
 Chip Quik Inc. | 4 | Solder Paste | 0.35 oz 5 ml 10 g | Syringe | 280 °F | 138 °C | No-Clean | 6 Months | 0.4 % 42 % 57.6 % | Date of Manufacture | Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended. | ||||||||||||||
 Chip Quik Inc. | 4 | Solder Paste | 1.23 oz 10 cc | 35 g | Syringe | No-Clean | 6 Months | Date of Manufacture | 220 °C | 428 °F | 422 °F | 217 °C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | ||||||||||||
 Chip Quik Inc. | Solder Paste | 1.76 oz | 50 g | Jar | 279 °F | 137 °C | No-Clean | Date of Manufacture | 5 | 12 Months | Bi57Sn42Ag1 | 57/42/1 |