Integrated Circuits (ICs)

SA58632BS,118

Obsolete

NXP USA Inc.

IC AMP CLSS AB STER 2.2W 20HVQFN

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Integrated Circuits (ICs)

SA58632BS,118

Obsolete

NXP USA Inc.

IC AMP CLSS AB STER 2.2W 20HVQFN

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DocumentsDatasheet

Specifications Series Pricing CAD Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	SA58632BS,118

Channels	2
Features	Short-Circuit and Thermal Protection, Standby, Depop, Mute
Load Impedance	8 Ohm
Maximum Output Power (per Channel)	2.2 W
Mounting Type	Surface Mount
Operating Temperature (Max)	85 °C
Operating Temperature (Min)	-40 °C
Output Type	2-Channel (Stereo)
Package / Case	20-VQFN Exposed Pad
Package Length	5 mm
Package Name	20-HVQFN
Package Width	6 mm
Type	Class AB
Voltage - Supply (Maximum)	18 V
Voltage - Supply (Minimum)	2.2 V

SA586 Series

Part	Voltage - Supply (Maximum)	Voltage - Supply (Minimum)	Type	Features	Channels	Load Impedance	Maximum Output Power (per Channel)	Package / Case	Package Name	Package Length	Package Width	Operating Temperature (Max)	Operating Temperature (Min)	Output Type	Mounting Type	Frequency	Current - Supply	RF Type	Number of Mixers	Gain	Secondary Attributes	Noise Figure	Test Frequency	Impedance	Topology	P1dB Additional	P1dB	Circuit	IIP3	Insertion Loss	Frequency Range (Max)	Frequency Range (Min)	Isolation	RF Family/Standard	Sensitivity	Power - Output	Current - Receiving
NXP USA Inc. SA58635UK,027	5.5 V	2.3 V	Class G	Depop I2C Short-Circuit and Thermal Protection Shutdown Volume Control	2	32 Ohm	25 mW	16-UFBGA WLCSP	16-WLCSP	1.7 mm	1.7 mm	85 °C	-40 °C	2-Channel (Stereo)	Surface Mount
NXP USA Inc. SA58631TK,157	18 V	2.2 V	Class AB	Depop Mute Short-Circuit and Thermal Protection Standby	1	8 Ohm	3 W	8-VDFN Exposed Pad	8-HVSON	4 mm	4 mm	85 °C	-40 °C	1-Channel (Mono)	Surface Mount
NXP USA Inc. SA58640DK,112	6 V	4.5 V							20-LSSOP 20-SSOP	0.173 in	4.4 mm				Surface Mount	100 MHz	6 mA	Cordless Phones	2	17 dB	Up Converter	7 dB
NXP USA Inc. SA58671UK,027	5.5 V	2.5 V	Class D	Differential Inputs Short-Circuit and Thermal Protection Shutdown	2	8 Ohm	1.3 W	16-UFBGA WLCSP	16-WLCSP	2.06 mm	2.11 mm	85 °C	-40 °C	2-Channel (Stereo)	Surface Mount
NXP USA Inc. SA58643DP,118	5.5 V	3 V		Single Line Control					8-TSSOP 8-TSSOP 8-MSOP	0.118 in	3 mm	85 °C	-40 °C		Surface Mount			802.11a b g WiFi WLAN					900 MHz	50 Ohm	Absorptive	OP1dB	18 dBm	SPDT	33 dBm	2 dB	1 GHz	0 Hz	30 dB
NXP USA Inc. SA58646BD,118	5.5 V	2.9 V	TxRx Only					64-LQFP	64-LQFP	10 mm	10 mm	85 °C	-40 °C		Surface Mount	900 MHz																		General ISM < 1GHz	-115 dBm	3 dBm	58 mA
NXP USA Inc. SA58631TK,118	18 V	2.2 V	Class AB	Depop Mute Short-Circuit and Thermal Protection Standby	1	8 Ohm	3 W	8-VDFN Exposed Pad	8-HVSON	4 mm	4 mm	85 °C	-40 °C	1-Channel (Mono)	Surface Mount
NXP USA Inc. SA58670BS,115	5.5 V	2.5 V	Class D	Differential Inputs Short-Circuit and Thermal Protection Shutdown	2	4 Ohm	2.1 W	20-VFQFN Exposed Pad	20-HVQFN	4 mm	4 mm	85 °C	-40 °C	2-Channel (Stereo)	Surface Mount
NXP USA Inc. SA58632BS,118	18 V	2.2 V	Class AB	Depop Mute Short-Circuit and Thermal Protection Standby	2	8 Ohm	2.2 W	20-VQFN Exposed Pad	20-HVQFN	5 mm	6 mm	85 °C	-40 °C	2-Channel (Stereo)	Surface Mount
NXP USA Inc. SA58670ABS,115	5.5 V	2.5 V	Class D	Differential Inputs Short-Circuit and Thermal Protection Shutdown	2	4 Ohm	2.1 W	20-VFQFN Exposed Pad	20-HVQFN	4 mm	4 mm	85 °C	-40 °C	2-Channel (Stereo)	Surface Mount

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$	Updated

CAD

3D models and CAD resources for this part

Description

General part information

SA586 Series

Amplifier IC 2-Channel (Stereo) Class AB 20-HVQFN (5x6)

Documents

Technical documentation and resources