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Discrete Semiconductor Products

SP8M31HZGTB

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Rohm Semiconductor

60V DUAL NCH+PCH AUTOMOTIVE POWER MOSFET

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Search across all available documentation for this part.

DocumentsPackage Dimensions Temperature derating method for Safe Operating Area (SOA)+39

8-SOIC

Discrete Semiconductor Products

SP8M31HZGTB

Active

Rohm Semiconductor

60V DUAL NCH+PCH AUTOMOTIVE POWER MOSFET

Deep-Dive with AI

DocumentsPackage Dimensions Temperature derating method for Safe Operating Area (SOA)+39

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	SP8M31HZGTB

Configuration	N and P-Channel
Current - Continuous Drain (Id) @ 25°C	4.5 A
Drain to Source Voltage (Vdss)	60 V
Gate Charge (Qg) (Max) @ Vgs	40 nC, 7 nC
Input Capacitance (Ciss) (Max) @ Vds	2500 pF, 500 pF
Mounting Type	Surface Mount
Operating Temperature	150 °C
Package / Case	0.154 in
Package / Case	8-SOIC
Package / Case	3.9 mm
Power - Max [Max]	2 W
Rds On (Max) @ Id, Vgs [Max]	70 mOhm
Rds On (Max) @ Id, Vgs [Min]	65 mOhm
Supplier Device Package	8-SOP
Technology	MOSFET (Metal Oxide)
Vgs(th) (Max) @ Id	3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 3.00
		10	$ 1.95
		100	$ 1.34
		500	$ 1.09
		1000	$ 1.00
	Digi-Reel®	1	$ 3.00
		10	$ 1.95
		100	$ 1.34
		500	$ 1.09
		1000	$ 1.00
	N/A	1178	$ 2.98
	Tape & Reel (TR)	2500	$ 0.91
		5000	$ 0.91
Mouser	N/A	1	$ 2.85
		10	$ 1.93
		100	$ 1.34
		500	$ 1.09
		1000	$ 1.00
		2500	$ 0.91
		5000	$ 0.91

Description

General part information

SP8M3 Series

SP8M31HZG is an automotive grade MOSFET that is AEC-Q101 qualified. Nch+Pch 60V MOSFETs with ESD protection diode is included in the SOP8 package. Ideal for switching applications.

Documents

Technical documentation and resources

Package Dimensions

Package Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Explanation for Marking

Package Information

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Reliability Test Result

Manufacturing Data

How to Use LTspice® Models

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

About Export Regulations

Export Information

What is a Thermal Model? (Transistor)

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Part Explanation

Application Note

SP8M31HZG ESD Data

Characteristics Data

SP8M31HZG Data Sheet

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Judgment Criteria of Thermal Evaluation

About Flammability of Materials

Environmental Data

Notes for Calculating Power Consumption:Static Operation

Compliance of the RoHS directive

Environmental Data

Basics of Thermal Resistance and Heat Dissipation

Precautions When Measuring the Rear of the Package with a Thermocouple

Two-Resistor Model for Thermal Simulation

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Moisture Sensitivity Level - Transistors

Package Information

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Taping Information

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Condition of Soldering / Land Pattern Reference

Package Information

Anti-Whisker formation - Transistors

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Types and Features of Transistors

Application Note

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

PCB Layout Thermal Design Guide

What Is Thermal Design

Notes for Temperature Measurement Using Thermocouples

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

SP8M3 Series

60V Dual Nch+Pch Automotive Power MOSFET

Part	Configuration	Gate Charge (Qg) (Max) @ Vgs	Input Capacitance (Ciss) (Max) @ Vds	Supplier Device Package	Technology	Power - Max [Max]	Package / Case	Package / Case	Package / Case	Operating Temperature	Mounting Type	Current - Continuous Drain (Id) @ 25°C	Rds On (Max) @ Id, Vgs	Vgs(th) (Max) @ Id	Drain to Source Voltage (Vdss)	Rds On (Max) @ Id, Vgs [Max]	Rds On (Max) @ Id, Vgs [Min]
Rohm Semiconductor SP8M3HZGTB	N and P-Channel	3.9 nC 8.5 nC	230 pF 850 pF	8-SOP	MOSFET (Metal Oxide)	2 W	0.154 in	8-SOIC	3.9 mm	150 °C	Surface Mount	4.5 A 5 A	51 mOhm 56 mOhm	2.5 V	30 V
Rohm Semiconductor SP8M3FU6TB1	N and P-Channel	3.9 nC 8.5 nC	230 pF 850 pF	8-SOP	MOSFET (Metal Oxide)	2 W	0.154 in	8-SOIC	3.9 mm	150 °C	Surface Mount	4.5 A 5 A	51 mOhm 56 mOhm	2.5 V	30 V
Rohm Semiconductor SP8M31HZGTB	N and P-Channel	7 nC 40 nC	500 pF 2500 pF	8-SOP	MOSFET (Metal Oxide)	2 W	0.154 in	8-SOIC	3.9 mm	150 °C	Surface Mount	4.5 A		3 V	60 V	70 mOhm	65 mOhm
Rohm Semiconductor SP8M3FD5TB1