Specification	SP8M3HZGTB

Configuration	N and P-Channel
Current - Continuous Drain (Id) @ 25°C	5 A, 4.5 A
Drain to Source Voltage (Vdss)	30 V
Gate Charge (Qg) (Max) @ Vgs	8.5 nC, 3.9 nC
Input Capacitance (Ciss) (Max) @ Vds	850 pF, 230 pF
Mounting Type	Surface Mount
Operating Temperature	150 °C
Package / Case	0.154 in
Package / Case	8-SOIC
Package / Case	3.9 mm
Power - Max [Max]	2 W
Rds On (Max) @ Id, Vgs	56 mOhm, 51 mOhm
Supplier Device Package	8-SOP
Technology	MOSFET (Metal Oxide)
Vgs(th) (Max) @ Id	2.5 V

SP8M3 Series

60V Dual Nch+Pch Automotive Power MOSFET

Part	Configuration	Gate Charge (Qg) (Max) @ Vgs	Input Capacitance (Ciss) (Max) @ Vds	Supplier Device Package	Technology	Power - Max [Max]	Package / Case	Package / Case	Package / Case	Operating Temperature	Mounting Type	Current - Continuous Drain (Id) @ 25°C	Rds On (Max) @ Id, Vgs	Vgs(th) (Max) @ Id	Drain to Source Voltage (Vdss)	Rds On (Max) @ Id, Vgs [Max]	Rds On (Max) @ Id, Vgs [Min]
Rohm Semiconductor SP8M3HZGTB	N and P-Channel	3.9 nC 8.5 nC	230 pF 850 pF	8-SOP	MOSFET (Metal Oxide)	2 W	0.154 in	8-SOIC	3.9 mm	150 °C	Surface Mount	4.5 A 5 A	51 mOhm 56 mOhm	2.5 V	30 V
Rohm Semiconductor SP8M3FU6TB1	N and P-Channel	3.9 nC 8.5 nC	230 pF 850 pF	8-SOP	MOSFET (Metal Oxide)	2 W	0.154 in	8-SOIC	3.9 mm	150 °C	Surface Mount	4.5 A 5 A	51 mOhm 56 mOhm	2.5 V	30 V
Rohm Semiconductor SP8M31HZGTB	N and P-Channel	7 nC 40 nC	500 pF 2500 pF	8-SOP	MOSFET (Metal Oxide)	2 W	0.154 in	8-SOIC	3.9 mm	150 °C	Surface Mount	4.5 A		3 V	60 V	70 mOhm	65 mOhm
Rohm Semiconductor SP8M3FD5TB1

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 2.11
		10	$ 1.35
		100	$ 0.92
		500	$ 0.73
		1000	$ 0.67
	Digi-Reel®	1	$ 2.11
		10	$ 1.35
		100	$ 0.92
		500	$ 0.73
		1000	$ 0.67
	N/A	1814	$ 2.10
	Tape & Reel (TR)	2500	$ 0.56
Newark	Each (Supplied on Full Reel)	2500	$ 0.60
		5000	$ 0.58

Description

General part information

SP8M3 Series

SP8M31HZG is an automotive grade MOSFET that is AEC-Q101 qualified. Nch+Pch 60V MOSFETs with ESD protection diode is included in the SOP8 package. Ideal for switching applications.

Documents

Technical documentation and resources

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

θJC and ΨJT

Thermal Design

What Is Thermal Design

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

SP8M3HZGTB

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SP8M3HZGTB

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Technical Specifications

SP8M3 Series

Pricing

Description

SP8M3 Series

Documents

How to Use LTspice&reg; Models

Condition of Soldering / Land Pattern Reference

Anti-Whisker formation - Transistors

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Moisture Sensitivity Level - Transistors

Certificate of not containing SVHC under REACH Regulation

MOSFET Gate Resistor Setting for Motor Driving

Part Explanation

SP8M3HZG ESD Data

Method for Monitoring Switching Waveform

Explanation for Marking

Package Dimensions

Types and Features of Transistors

Judgment Criteria of Thermal Evaluation

MOSFET Gate Drive Current Setting for Motor Driving

PCB Layout Thermal Design Guide

Compliance of the RoHS directive

About Flammability of Materials

Notes for Temperature Measurement Using Forward Voltage of PN Junction

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Taping Information

Temperature derating method for Safe Operating Area (SOA)

About Export Regulations

Notes for Calculating Power Consumption:Static Operation

Reliability Test Result

Measurement Method and Usage of Thermal Resistance RthJC

How to Use LTspice&reg; Models: Tips for Improving Convergence

List of Transistor Package Thermal Resistance

SP8M3HZG Data Sheet

Calculation of Power Dissipation in Switching Circuit

Importance of Probe Calibration When Measuring Power: Deskew

Two-Resistor Model for Thermal Simulation

Precautions When Measuring the Rear of the Package with a Thermocouple

Impedance Characteristics of Bypass Capacitor

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

θ<sub>JC</sub> and Ψ<sub>JT</sub>

What Is Thermal Design

What is a Thermal Model? (Transistor)

Notes for Temperature Measurement Using Thermocouples

Basics of Thermal Resistance and Heat Dissipation

SP8M3 Series

How to Use LTspice® Models

How to Use LTspice® Models: Tips for Improving Convergence