Connectors, Interconnects

39-0518-10

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CONN SOCKET SIP 39POS GOLD

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Connectors, Interconnects

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CONN SOCKET SIP 39POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	39-0518-10

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	0.25 µm
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Open Frame
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid) [custom]	39
Number of Positions or Pins (Grid) [x]	1
Number of Positions or Pins (Grid) [y]	39
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Termination Post Length	0.125 in
Termination Post Length	3.18 mm
Type	SIP

Part	Current Rating (Amps)	Termination Post Length	Termination Post Length	Material Flammability Rating	Housing Material	Contact Material - Mating	Features	Type	Contact Finish - Post	Pitch - Post	Pitch - Post	Mounting Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Contact Material - Post [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]
Aries Electronics 39-0518-10H	3 A	0.125 in	3.18 mm	UL94 V-0	Polyamide (PA46) Nylon 4/6 Glass Filled	Beryllium Copper	Open Frame	SIP	Tin	0.1 in	2.54 mm	Through Hole	200 µin	5.08 µm	0.25 µm	10 µin	Solder	0.1 "	2.54 mm	Gold	Brass	39	1	39
Aries Electronics 39-0518-10T	3 A	0.125 in	3.18 mm	UL94 V-0	Polyamide (PA46) Nylon 4/6 Glass Filled	Beryllium Copper	Open Frame	SIP	Tin	0.1 in	2.54 mm	Through Hole	200 µin	5.08 µm	0.25 µm	10 µin	Solder	0.1 "	2.54 mm	Gold	Brass	39	1	39
Aries Electronics 39-0518-00	3 A	0.046 in	1.17 mm	UL94 V-0	Polyamide (PA46) Nylon 4/6 Glass Filled	Beryllium Copper	Open Frame	SIP	Tin	0.1 in	2.54 mm	Surface Mount	200 µin	5.08 µm	0.25 µm	10 µin	Solder	0.1 "	2.54 mm	Gold	Brass	39	1	39
Aries Electronics 39-0518-10	3 A	0.125 in	3.18 mm	UL94 V-0	Polyamide (PA46) Nylon 4/6 Glass Filled	Beryllium Copper	Open Frame	SIP	Tin	0.1 in	2.54 mm	Through Hole	200 µin	5.08 µm	0.25 µm	10 µin	Solder	0.1 "	2.54 mm	Gold	Brass	39	1	39

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

39 (1 x 39) Pos SIP Socket Gold Through Hole

Technical documentation and resources