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CSD95372BQ5MC

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Texas Instruments

60A SYNCHRONOUS BUCK NEXFET™ SMART POWER STAGE WITH DUAL COOL PACKAGE

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VSON-CLIP (DMC)
Integrated Circuits (ICs)

CSD95372BQ5MC

Active
Texas Instruments

60A SYNCHRONOUS BUCK NEXFET™ SMART POWER STAGE WITH DUAL COOL PACKAGE

Technical Specifications

Parameters and characteristics for this part

SpecificationCSD95372BQ5MC
ApplicationsSynchronous Buck Converters
Current - Output / Channel60 A
Fault ProtectionOver Temperature, Short Circuit, Shoot-Through, Current Limiting, UVLO
FeaturesBootstrap Circuit, Status Flag
InterfacePWM
Load TypeInductive
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-55 °C
Package / Case12-PowerTFDFN
Supplier Device Package12-VSON (5x6)
TechnologyPower MOSFET
Voltage - Load [Max]16 V
Voltage - Load [Min]4.5 V
Voltage - Supply [Max]5.5 V
Voltage - Supply [Min]4.5 V

CSD95372BQ5MC Series

60A Synchronous Buck NexFET™ Smart Power Stage with Dual Cool package

PartPackage / CaseSupplier Device PackageOperating Temperature [Min]Operating Temperature [Max]ApplicationsVoltage - Supply [Min]Voltage - Supply [Max]Load TypeFeaturesTechnologyVoltage - Load [Max]Voltage - Load [Min]Fault ProtectionInterfaceCurrent - Output / ChannelMounting Type
12-VSON
Texas Instruments
12-PowerTFDFN
12-VSON (5x6)
-55 °C
150 °C
Synchronous Buck Converters
4.5 V
5.5 V
Inductive
Bootstrap Circuit
Status Flag
Power MOSFET
16 V
4.5 V
Current Limiting
Over Temperature
Shoot-Through
Short Circuit
UVLO
PWM
60 A
Surface Mount
12-LSON
Texas Instruments
12-PowerLFDFN
12-LSON-CLIP (5x6)
-55 °C
150 °C
Synchronous Buck Converters
4.5 V
5.5 V
Inductive
Bootstrap Circuit
Status Flag
Power MOSFET
16 V
4.5 V
Current Limiting
Over Temperature
Shoot-Through
Short Circuit
UVLO
PWM
60 A
Surface Mount
12-LSON
Texas Instruments
12-PowerLFDFN
12-LSON-CLIP (5x6)
-55 °C
150 °C
Synchronous Buck Converters
4.5 V
5.5 V
Inductive
Bootstrap Circuit
Status Flag
Power MOSFET
16 V
4.5 V
Current Limiting
Over Temperature
Shoot-Through
Short Circuit
UVLO
PWM
60 A
Surface Mount
LSON-CLIP (DQP)
Texas Instruments
12-PowerLFDFN
12-LSON-CLIP (5x6)
-55 °C
150 °C
Synchronous Buck Converters
4.5 V
5.5 V
Inductive
Bootstrap Circuit
Status Flag
Power MOSFET
16 V
4.5 V
Over Temperature
Shoot-Through
UVLO
PWM
60 A
Surface Mount
VSON-CLIP (DMC)
Texas Instruments
12-PowerTFDFN
12-VSON (5x6)
-55 °C
150 °C
Synchronous Buck Converters
4.5 V
5.5 V
Inductive
Bootstrap Circuit
Status Flag
Power MOSFET
16 V
4.5 V
Current Limiting
Over Temperature
Shoot-Through
Short Circuit
UVLO
PWM
60 A
Surface Mount

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 5.65
10$ 5.04
25$ 4.54
100$ 4.14
250$ 3.73
500$ 3.35
1000$ 2.83
Digi-Reel® 1$ 5.65
10$ 5.04
25$ 4.54
100$ 4.14
250$ 3.73
500$ 3.35
1000$ 2.83
Tape & Reel (TR) 2500$ 2.68
Texas InstrumentsLARGE T&R 1$ 4.04
100$ 3.54
250$ 2.48
1000$ 2.00

Description

General part information

CSD95372BQ5MC Series

The CSD95372AQ5M NexFET™ Power Stage is a highly optimized design for use in a high power, high density Synchronous Buck converters. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. This combination produces high current, high efficiency, and high speed switching capability in a small 5 × 6 mm outline package. It also integrates the temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

The CSD95372AQ5M NexFET™ Power Stage is a highly optimized design for use in a high power, high density Synchronous Buck converters. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. This combination produces high current, high efficiency, and high speed switching capability in a small 5 × 6 mm outline package. It also integrates the temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.