CSD95372BQ5MC Series

60A Synchronous Buck NexFET™ Smart Power Stage with Dual Cool package

Catalog

60A Synchronous Buck NexFET™ Smart Power Stage with Dual Cool package

Part	Package / Case	Supplier Device Package	Operating Temperature [Min]	Operating Temperature [Max]	Applications	Voltage - Supply [Min]	Voltage - Supply [Max]	Load Type	Features	Technology	Voltage - Load [Max]	Voltage - Load [Min]	Fault Protection	Interface	Current - Output / Channel	Mounting Type
Texas Instruments CSD95372BQ5MCT	12-PowerTFDFN	12-VSON (5x6)	-55 °C	150 °C	Synchronous Buck Converters	4.5 V	5.5 V	Inductive	Bootstrap Circuit Status Flag	Power MOSFET	16 V	4.5 V	Current Limiting Over Temperature Shoot-Through Short Circuit UVLO	PWM	60 A	Surface Mount
Texas Instruments CSD95372BQ5MT	12-PowerLFDFN	12-LSON-CLIP (5x6)	-55 °C	150 °C	Synchronous Buck Converters	4.5 V	5.5 V	Inductive	Bootstrap Circuit Status Flag	Power MOSFET	16 V	4.5 V	Current Limiting Over Temperature Shoot-Through Short Circuit UVLO	PWM	60 A	Surface Mount
Texas Instruments CSD95372BQ5M	12-PowerLFDFN	12-LSON-CLIP (5x6)	-55 °C	150 °C	Synchronous Buck Converters	4.5 V	5.5 V	Inductive	Bootstrap Circuit Status Flag	Power MOSFET	16 V	4.5 V	Current Limiting Over Temperature Shoot-Through Short Circuit UVLO	PWM	60 A	Surface Mount
Texas Instruments CSD95372AQ5M	12-PowerLFDFN	12-LSON-CLIP (5x6)	-55 °C	150 °C	Synchronous Buck Converters	4.5 V	5.5 V	Inductive	Bootstrap Circuit Status Flag	Power MOSFET	16 V	4.5 V	Over Temperature Shoot-Through UVLO	PWM	60 A	Surface Mount
Texas Instruments CSD95372BQ5MC	12-PowerTFDFN	12-VSON (5x6)	-55 °C	150 °C	Synchronous Buck Converters	4.5 V	5.5 V	Inductive	Bootstrap Circuit Status Flag	Power MOSFET	16 V	4.5 V	Current Limiting Over Temperature Shoot-Through Short Circuit UVLO	PWM	60 A	Surface Mount

Catalog

60A Synchronous Buck NexFET™ Smart Power Stage with Dual Cool package

Key Features

• 60-A Continuous Operating Current Capability93.4% System Efficiency at 30 ALow Power Loss of 2.8 W at 30 AHigh-Frequency Operation (up to 1.25 MHz)Diode Emulation Mode With FCCMTemperature-Compensated Bidirectional CurrentSenseAnalog Temperature Output (600 mV at 0°C)Fault MonitoringHigh-Side Short, Overcurrent, andOvertemperature Protection3.3-V and 5-V PWM Signal CompatibleTri-State PWM InputIntegrated Bootstrap DiodeOptimized Deadtime for Shoot-Through ProtectionHigh-Density SON 5 × 6 mm FootprintUltra-Low Inductance PackageSystem-Optimized PCB FootprintDualCool™ PackagingRoHS Compliant – Lead-Free Terminal PlatingHalogen-Free60-A Continuous Operating Current Capability93.4% System Efficiency at 30 ALow Power Loss of 2.8 W at 30 AHigh-Frequency Operation (up to 1.25 MHz)Diode Emulation Mode With FCCMTemperature-Compensated Bidirectional CurrentSenseAnalog Temperature Output (600 mV at 0°C)Fault MonitoringHigh-Side Short, Overcurrent, andOvertemperature Protection3.3-V and 5-V PWM Signal CompatibleTri-State PWM InputIntegrated Bootstrap DiodeOptimized Deadtime for Shoot-Through ProtectionHigh-Density SON 5 × 6 mm FootprintUltra-Low Inductance PackageSystem-Optimized PCB FootprintDualCool™ PackagingRoHS Compliant – Lead-Free Terminal PlatingHalogen-Free

Description

The CSD95372AQ5M NexFET™ Power Stage is a highly optimized design for use in a high power, high density Synchronous Buck converters. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. This combination produces high current, high efficiency, and high speed switching capability in a small 5 × 6 mm outline package. It also integrates the temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design. The CSD95372AQ5M NexFET™ Power Stage is a highly optimized design for use in a high power, high density Synchronous Buck converters. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. This combination produces high current, high efficiency, and high speed switching capability in a small 5 × 6 mm outline package. It also integrates the temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.