Zenode.ai Logo
Beta
No image
Connectors, Interconnects

22-6503-20

Active
Aries Electronics

CONN IC DIP SOCKET 22POS GOLD

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsDatasheet
Connectors, Interconnects

22-6503-20

Active
Aries Electronics

CONN IC DIP SOCKET 22POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

Specification22-6503-20
Contact Finish - MatingGold
Contact Finish - PostTin
Contact Finish Thickness - Mating10 çin
Contact Finish Thickness - Mating0.25 çm
Contact Finish Thickness - Post200 µin
Contact Finish Thickness - Post5.08 µm
Contact Material - MatingBeryllium Copper
Contact Material - PostPhosphor Bronze
Current Rating (Amps)3 A
FeaturesClosed Frame
Housing MaterialGlass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)22
Operating Temperature [Max]105 ░C
Operating Temperature [Min]-55 °C
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Pitch - Post2.54 mm
Pitch - Post0.1 in
TerminationWire Wrap
Termination Post Length [x]0.36 in
Termination Post Length [x]9.14 mm
TypeDIP
Type0.6 in
Type15.24 mm
PartTerminationContact Finish Thickness - PostContact Finish Thickness - PostTermination Post LengthTermination Post LengthPitch - PostPitch - PostMounting TypePitch - MatingPitch - MatingHousing MaterialFeaturesNumber of Positions or Pins (Grid)Contact Material - PostMaterial Flammability RatingContact Finish Thickness - MatingContact Finish Thickness - MatingContact Material - MatingOperating Temperature [Min]Operating Temperature [Max]Contact Finish - PostTypeTypeTypeCurrent Rating (Amps)Contact Finish - MatingTermination Post Length [x]Termination Post Length [x]For Use With/Related ProductsNumber of PositionsAccessory Type
Aries Electronics
Wire Wrap
200 µin
5.08 µm
17.52 mm
0.69 in
2.54 mm
0.1 in
Through Hole
0.1 in
2.54 mm
Glass Filled
Nylon 4/6
Polyamide (PA46)
Closed Frame
22
Phosphor Bronze
UL94 V-0
5.08 µm
200 µin
Phosphor Bronze
-55 °C
125 °C
Tin
DIP
0.6 in
15.24 mm
1.5 A
Aries Electronics
Wire Wrap
10 çin
0.25 çm
12.7 mm
0.5 in
2.54 mm
0.1 in
Through Hole
0.1 in
2.54 mm
Glass Filled
Nylon 4/6
Polyamide (PA46)
Closed Frame
22
Phosphor Bronze
UL94 V-0
0.25 çm
10 çin
Beryllium Copper
-55 °C
125 °C
Gold
DIP
0.6 in
15.24 mm
3 A
Gold
Aries Electronics
Wire Wrap
10 çin
0.25 çm
2.54 mm
0.1 in
Through Hole
0.1 in
2.54 mm
Glass Filled
Nylon 4/6
Polyamide (PA46)
Closed Frame
22
Phosphor Bronze
UL94 V-0
0.25 çm
10 çin
Beryllium Copper
-55 °C
125 °C
Gold
DIP
0.6 in
15.24 mm
3 A
Gold
0.36 in
9.14 mm
Aries Electronics
Wire Wrap
200 µin
5.08 µm
10.41 mm
0.41 in
2.54 mm
0.1 in
Through Hole
0.1 in
2.54 mm
Glass Filled
Nylon 4/6
Polyamide (PA46)
Closed Frame
22
Phosphor Bronze
UL94 V-0
5.08 µm
200 µin
Phosphor Bronze
-55 °C
105 ░C
Tin
DIP
0.6 in
15.24 mm
1.5 A
Aries Electronics
Wire Wrap
10 çin
0.25 çm
10.41 mm
0.41 in
2.54 mm
0.1 in
Through Hole
0.1 in
2.54 mm
Glass Filled
Nylon 4/6
Polyamide (PA46)
Closed Frame
22
Phosphor Bronze
UL94 V-0
0.25 çm
10 çin
Phosphor Bronze
-55 °C
125 °C
Gold
DIP
0.6 in
15.24 mm
1.5 A
Gold
Aries Electronics
Wire Wrap
200 µin
5.08 µm
2.54 mm
0.1 in
Through Hole
0.1 in
2.54 mm
Glass Filled
Nylon 4/6
Polyamide (PA46)
Closed Frame
22
Phosphor Bronze
UL94 V-0
0.25 çm
10 çin
Beryllium Copper
-55 °C
105 ░C
Tin
DIP
0.6 in
15.24 mm
3 A
Gold
0.36 in
9.14 mm
Aries Electronics
Wire Wrap
10 çin
0.25 çm
17.52 mm
0.69 in
2.54 mm
0.1 in
Through Hole
0.1 in
2.54 mm
Glass Filled
Nylon 4/6
Polyamide (PA46)
Closed Frame
22
Phosphor Bronze
UL94 V-0
0.25 çm
10 çin
Phosphor Bronze
-55 °C
125 °C
Gold
DIP
0.6 in
15.24 mm
1.5 A
Gold
Aries Electronics
0600 Series Header
22 positions
Cap (Cover)

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 47$ 9.69

Description

General part information

22-650 Series

22 (2 x 11) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources