
Integrated Circuits (ICs)
DSPIC30F3013-20I/ML
ActiveMicrochip Technology
16-BIT, FLASH, 20 MHZ, RISC MICROCONTROLLER, PQCC44, 8 X 8 MM, PLASTIC, MO-220, QFN-44
Deep-Dive with AI
Search across all available documentation for this part.

Integrated Circuits (ICs)
DSPIC30F3013-20I/ML
ActiveMicrochip Technology
16-BIT, FLASH, 20 MHZ, RISC MICROCONTROLLER, PQCC44, 8 X 8 MM, PLASTIC, MO-220, QFN-44
Technical Specifications
Parameters and characteristics for this part
| Specification | DSPIC30F3013-20I/ML |
|---|---|
| Connectivity | I2C, SPI, UART/USART |
| Core Processor | dsPIC |
| Core Size | 16-Bit |
| Mounting Type | Surface Mount |
| Number of I/O | 20 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Oscillator Type | Internal |
| Package / Case | 44-VQFN Exposed Pad |
| Program Memory Size | 24 KB |
| Program Memory Type | FLASH |
| RAM Size | 2K x 8 |
| Speed | 20 MIPS |
| Supplier Device Package | 44-QFN (8x8) |
| Voltage - Supply (Vcc/Vdd) [Max] | 5.5 V |
| Voltage - Supply (Vcc/Vdd) [Min] | 2.5 V |
| Part | Operating Temperature [Min] | Operating Temperature [Max] | Mounting Type | Number of I/O | Program Memory Type | RAM Size | Package / Case | Oscillator Type | Speed | Core Processor | Core Size | Voltage - Supply (Vcc/Vdd) [Min] | Voltage - Supply (Vcc/Vdd) [Max] | Connectivity | Program Memory Size | Supplier Device Package | Package / Case | Package / Case | Package / Case [x] | Package / Case [y] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology | -40 °C | 125 °C | Surface Mount | 20 | FLASH | 2K x 8 | 44-VQFN Exposed Pad | Internal | 20 MIPS | dsPIC | 16-Bit | 2.5 V | 5.5 V | I2C SPI UART/USART | 24 KB | 44-QFN (8x8) | ||||
Microchip Technology | -40 °C | 125 °C | Through Hole | 20 | FLASH | 2K x 8 | 28-DIP | Internal | 20 MIPS | dsPIC | 16-Bit | 2.5 V | 5.5 V | I2C SPI UART/USART | 24 KB | 28-SPDIP | 0.3 in | 7.62 mm | ||
Microchip Technology | -40 °C | 125 °C | Surface Mount | 20 | FLASH | 2K x 8 | 44-VQFN Exposed Pad | Internal | 20 MIPS | dsPIC | 16-Bit | 2.5 V | 5.5 V | I2C SPI UART/USART | 24 KB | 44-QFN (8x8) | ||||
Microchip Technology | -40 °C | 85 °C | Through Hole | 20 | FLASH | 2K x 8 | 28-DIP | Internal | 30 MIPs | dsPIC | 16-Bit | 2.5 V | 5.5 V | I2C SPI UART/USART | 24 KB | 28-SPDIP | 0.3 in | 7.62 mm | ||
Microchip Technology | -40 °C | 85 °C | Surface Mount | 20 | FLASH | 2K x 8 | 44-VQFN Exposed Pad | Internal | 30 MIPs | dsPIC | 16-Bit | 2.5 V | 5.5 V | I2C SPI UART/USART | 24 KB | 44-QFN (8x8) | ||||
Microchip Technology | -40 °C | 85 °C | Surface Mount | 20 | FLASH | 2K x 8 | 44-VQFN Exposed Pad | Internal | 20 MIPS | dsPIC | 16-Bit | 2.5 V | 5.5 V | I2C SPI UART/USART | 24 KB | 44-QFN (8x8) | ||||
Microchip Technology | -40 °C | 85 °C | Surface Mount | 20 | FLASH | 2K x 8 | 44-VQFN Exposed Pad | Internal | 30 MIPs | dsPIC | 16-Bit | 2.5 V | 5.5 V | I2C SPI UART/USART | 24 KB | 44-QFN (8x8) | ||||
Microchip Technology | -40 °C | 85 °C | Through Hole | 20 | FLASH | 2K x 8 | 28-DIP | Internal | 20 MIPS | dsPIC | 16-Bit | 2.5 V | 5.5 V | I2C SPI UART/USART | 24 KB | 28-SPDIP | 0.3 in | 7.62 mm | ||
Microchip Technology | -40 °C | 85 °C | Surface Mount | 20 | FLASH | 2K x 8 | 28-SOIC | Internal | 20 MIPS | dsPIC | 16-Bit | 2.5 V | 5.5 V | I2C SPI UART/USART | 24 KB | 28-SOIC | 0.295 in | 7.5 mm | ||
Microchip Technology | -40 °C | 85 °C | Surface Mount | 20 | FLASH | 2K x 8 | 28-SOIC | Internal | 20 MIPS | dsPIC | 16-Bit | 2.5 V | 5.5 V | I2C SPI UART/USART | 24 KB | 28-SOIC | 0.295 in | 7.5 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tube | 225 | $ 5.72 | |
| Microchip Direct | TUBE | 1 | $ 6.49 | |
| 25 | $ 5.92 | |||
| 100 | $ 5.38 | |||
| 1000 | $ 4.92 | |||
| 5000 | $ 4.69 | |||
| Newark | Each | 100 | $ 5.55 | |
Description
General part information
dsPIC30F3013 Series
dsPIC30F Motor Control 16-bit Digital Signal Controller.
Seamless migration options from this device to dsPIC33F and PIC24 devices in similar packages.
Documents
Technical documentation and resources