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Integrated Circuits (ICs)

TC4425COE713

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Microchip Technology

MOSFET DRVR 3A 2-OUT LO SIDE INV/NON-INV 16-PIN SOIC W T/R

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RW-16
Integrated Circuits (ICs)

TC4425COE713

Active
Microchip Technology

MOSFET DRVR 3A 2-OUT LO SIDE INV/NON-INV 16-PIN SOIC W T/R

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationTC4425COE713
Channel TypeIndependent
Current - Peak Output (Source, Sink) [custom]3 A
Current - Peak Output (Source, Sink) [custom]3 A
Driven ConfigurationLow-Side
Gate TypeN-Channel, P-Channel MOSFET
Input TypeNon-Inverting, Inverting
Mounting TypeSurface Mount
Number of Drivers2
Operating Temperature [Max]150 °C
Operating Temperature [Min]0 °C
Package / Case16-SOIC
Package / Case [x]0.295 in
Package / Case [y]7.5 mm
Rise / Fall Time (Typ) [custom]25 ns
Rise / Fall Time (Typ) [custom]23 ns
Supplier Device Package16-SOIC
Voltage - Supply [Max]18 V
Voltage - Supply [Min]4.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTape & Reel (TR) 1000$ 2.59

Description

General part information

TC4425A Series

The TC4423/4424/4425 are higher output current versions of the new TC4426/4427/4428 buffer/gate drivers, which, in turn, are improved versions of the earlier TC426/427/428 series. All three families are pin-compatible. The TC4423/4424/4425 drivers are capable of giving reliable service in far more demanding electrical environments than their antecedents. Although primarily intended for driving power MOSFETs, the TC4423/4424/4425 drivers are equally well-suited to driving any other load (capacitive, resistive, or inductive) which requires a low impedance driver capable of high peak currents and fast switching times. For example, heavily loaded clock lines, coaxial cables, or piezoelectric transducers can all be driven from the TC4423/4424/4425. The only known limitation on loading is the total power dissipated in the driver must be kept within the maximum power dissipation limits of the package.

Documents

Technical documentation and resources