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TO-18
Discrete Semiconductor Products

2N4029

Active
Microchip Technology

80 V SMALL-SIGNAL BJT TO-18 ROHS COMPLIANT: YES

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TO-18
Discrete Semiconductor Products

2N4029

Active
Microchip Technology

80 V SMALL-SIGNAL BJT TO-18 ROHS COMPLIANT: YES

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

Specification2N4029
Current - Collector (Ic) (Max) [Max]1 A
Current - Collector Cutoff (Max) [Max]10 µA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]100 hFE
Mounting TypeThrough Hole
Package / CaseTO-18-3 Metal Can, TO-206AA
Power - Max [Max]500 mW
Supplier Device PackageTO-18
Transistor TypePNP
Vce Saturation (Max) @ Ib, Ic1 V
Voltage - Collector Emitter Breakdown (Max) [Max]80 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 101$ 8.23
Microchip DirectN/A 1$ 8.86
NewarkEach 100$ 8.23
500$ 7.91

Description

General part information

2N4029-Transistor Series

This specification covers the performance requirements for PNP silicon, 2N4029 and 2N4033 transistors for use in high speed switching and driver applications. Four levels of product assurance (JAN, JANTX, JANTXV and JANS) are provided for each encapsulated device type as specified in MIL-PRF-19500/512 and two levels of product assurance (JANHC and JANKC) for each unencapsulated device type. Provisions for radiation hardness assurance (RHA), eight radiation levels is provided for JANTXV and JANS product assurance levels. RHA level designators "M", "D", P", "L", "R", "F", "G", and "H" are appended to the device prefix to identify devices, which have passed RHA requirements. The device package for the encapsulated device types are as follows: TO-18, TO-39, and surface mount UA and UB. The dimensions and topography for JANHC and JANKC unencapsulated die are as outlined in MIL-PRF-19500/512.