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896-FCBGA
Integrated Circuits (ICs)

PM8310A-FEI

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Microchip Technology

TEMUX 336NG, PB FREE BUMP 896 HBBGA 31X31X3.12MM TRAY ROHS COMPLIANT: YES

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896-FCBGA
Integrated Circuits (ICs)

PM8310A-FEI

Active
Microchip Technology

TEMUX 336NG, PB FREE BUMP 896 HBBGA 31X31X3.12MM TRAY ROHS COMPLIANT: YES

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationPM8310A-FEI
FunctionFramer
Interface4-Wire, Serial, TDM
Mounting TypeSurface Mount
Number of Circuits1
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Package / Case896-BGA, FCBGA
Supplier Device Package896-FCBGA (31x31)

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTray 27$ 768.13
Microchip DirectTRAY 1$ 922.00
25$ 768.13
100$ 698.54
NewarkEach 25$ 768.13
100$ 698.54

Description

General part information

PM8310 Series

The PM8310 TEMUX-336 is a high density T1/E1 framer, VT/TU mapper, and M13 multiplexer with integrated SONET/SDH framers for OC- 12/STM-4 and 4xOC-3/STM-1 applications. Feature integration and scalability make the TEMUX-336 ideal for use in ATCA/AMC line cards, voice and media gateways, routers, and multi-service and edge aggregation switches.

The TEMUX-336 device's unique Extended Serial SONET/SDH Interface (ESSI) enables:

• A low pin-count interconnect to additional TEMUX-336 devices for equipment protection applications

Documents

Technical documentation and resources