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8-X2SON Pkg
Integrated Circuits (ICs)

SN74AUP3G34DQER

Active
Texas Instruments

IC BUF NON-INVERT 3.6V 8X2SON

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8-X2SON Pkg
Integrated Circuits (ICs)

SN74AUP3G34DQER

Active
Texas Instruments

IC BUF NON-INVERT 3.6V 8X2SON

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationSN74AUP3G34DQER
Current - Output High, Low [custom]4 mA
Current - Output High, Low [custom]4 mA
Logic TypeBuffer, Non-Inverting
Mounting TypeSurface Mount
Number of Bits per Element1
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Output TypePush-Pull
Package / Case8-XFDFN
Supplier Device Package8-X2SON (1.4x1)
Voltage - Supply [Max]3.6 V
Voltage - Supply [Min]0.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.36
10$ 0.29
25$ 0.27
100$ 0.20
250$ 0.18
500$ 0.15
1000$ 0.11
2500$ 0.10
Digi-Reel® 1$ 0.36
10$ 0.29
25$ 0.27
100$ 0.20
250$ 0.18
500$ 0.15
1000$ 0.11
2500$ 0.10
Tape & Reel (TR) 5000$ 0.10
10000$ 0.09
25000$ 0.08
50000$ 0.08
125000$ 0.08

Description

General part information

SN74AUP3G34 Series

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).

The SN74AUP3G34 performs the Boolean function Y = A in positive logic.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

Documents

Technical documentation and resources

No documents available