SN74AUP3G34YFPR
ActiveBUFFER 3-CH NON-INVERTING PUSH-PULL CMOS 8-PIN DSBGA T/R
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SN74AUP3G34YFPR
ActiveBUFFER 3-CH NON-INVERTING PUSH-PULL CMOS 8-PIN DSBGA T/R
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Technical Specifications
Parameters and characteristics for this part
| Specification | SN74AUP3G34YFPR |
|---|---|
| Current - Output High, Low [custom] | 4 mA |
| Current - Output High, Low [custom] | 4 mA |
| Logic Type | Buffer, Non-Inverting |
| Mounting Type | Surface Mount |
| Number of Bits per Element | 1 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Output Type | Push-Pull |
| Package / Case | 8-XFBGA, DSBGA |
| Supplier Device Package | 8-DSBGA |
| Voltage - Supply [Max] | 3.6 V |
| Voltage - Supply [Min] | 0.8 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 0.98 | |
| 10 | $ 0.88 | |||
| 25 | $ 0.83 | |||
| 100 | $ 0.68 | |||
| 250 | $ 0.64 | |||
| 500 | $ 0.56 | |||
| 1000 | $ 0.45 | |||
| Digi-Reel® | 1 | $ 0.98 | ||
| 10 | $ 0.88 | |||
| 25 | $ 0.83 | |||
| 100 | $ 0.68 | |||
| 250 | $ 0.64 | |||
| 500 | $ 0.56 | |||
| 1000 | $ 0.45 | |||
| Tape & Reel (TR) | 3000 | $ 0.42 | ||
| 6000 | $ 0.39 | |||
| 15000 | $ 0.38 | |||
| Texas Instruments | LARGE T&R | 1 | $ 0.73 | |
| 100 | $ 0.56 | |||
| 250 | $ 0.41 | |||
| 1000 | $ 0.29 | |||
Description
General part information
SN74AUP3G34 Series
The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).
The SN74AUP3G34 performs the Boolean function Y = A in positive logic.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
Documents
Technical documentation and resources
