Integrated Circuits (ICs)

M1A3P1000-FG484

Active

PROASIC3 FPGA, ARM CORTEX-M1, 11KLES 484 PBGA 23X23X2.44MM TRAY ROHS COMPLIANT: YES

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Integrated Circuits (ICs)

Active

PROASIC3 FPGA, ARM CORTEX-M1, 11KLES 484 PBGA 23X23X2.44MM TRAY ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

Ultra Low Density FPGAs

Part	Number of I/O	Package / Case	Supplier Device Package	Voltage - Supply [Max]	Voltage - Supply [Min]	Operating Temperature [Min]	Operating Temperature [Max]	Number of Gates	Total RAM Bits	Mounting Type
Microchip Technology M1A3P1000-FG484	300 I/O	484-BGA	484-FPBGA (23x23)	1.575 V	1.425 V	0 °C	85 °C	1000000	147456 bits	Surface Mount
Microchip Technology M1A3P1000-PQ208	154	208-BFQFP	208-PQFP (28x28)	1.575 V	1.425 V	0 °C	85 °C	1000000	147456 bits	Surface Mount
Microchip Technology M1A3P1000-1PQG208I	154	208-BFQFP	208-PQFP (28x28)	1.575 V	1.425 V	-40 C	100 °C	1000000	147456 bits	Surface Mount
Microchip Technology M1A3P1000L-1FG256	177	256-LBGA	256-FPBGA (17x17)	1.575 V	1.14 V	0 °C	85 °C	1000000	147456 bits	Surface Mount
Microchip Technology M1A3P1000-1PQG208	154	208-BFQFP	208-PQFP (28x28)	1.575 V	1.425 V	0 °C	85 °C	1000000	147456 bits	Surface Mount
Microchip Technology M1A3P1000-1FG484I	300 I/O	484-BGA	484-FPBGA (23x23)	1.575 V	1.425 V	-40 C	100 °C	1000000	147456 bits	Surface Mount
Microchip Technology M1A3P1000-1FGG256	177	256-LBGA	256-FPBGA (17x17)	1.575 V	1.425 V	0 °C	85 °C	1000000	147456 bits	Surface Mount
Microchip Technology M1A3P1000-1FG144M	97	144-LBGA	13x13 144-FPBGA	1.575 V	1.425 V	-55 °C	125 ¯C	1000000	147456 bits	Surface Mount
Microchip Technology M1A3P1000-2FGG144	97	144-LBGA	13x13 144-FPBGA	1.575 V	1.425 V	0 °C	85 °C	1000000	147456 bits	Surface Mount
Microchip Technology M1A3P1000L-1FGG256	177	256-LBGA	256-FPBGA (17x17)	1.575 V	1.14 V	0 °C	85 °C	1000000	147456 bits	Surface Mount

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

ProASIC3L

offers lower power features with low dynamic and static powers, high

performance in ultra low dendity FPGAs, a single-chip solution, small

Technical documentation and resources