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2N3879_view2
Discrete Semiconductor Products

2N3741

Active
Microchip Technology

80V 4A 25W NPN POWER BJT THT TO-66 ROHS COMPLIANT: YES

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2N3879_view2
Discrete Semiconductor Products

2N3741

Active
Microchip Technology

80V 4A 25W NPN POWER BJT THT TO-66 ROHS COMPLIANT: YES

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

Specification2N3741
Current - Collector (Ic) (Max) [Max]4 A
Current - Collector Cutoff (Max) [Max]10 µA
DC Current Gain (hFE) (Min) @ Ic, Vce40
Mounting TypeThrough Hole
Package / CaseTO-66-2, TO-213AA
Power - Max [Max]25 W
Supplier Device PackageTO-66 (TO-213AA)
Transistor TypePNP
Vce Saturation (Max) @ Ib, Ic [Max]600 mV
Voltage - Collector Emitter Breakdown (Max) [Max]80 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 1$ 14.76
100$ 13.71
Microchip DirectN/A 1$ 14.76
NewarkEach 100$ 13.71
500$ 13.19

Description

General part information

2N3741-Transistor Series

This specification covers the performance requirements for power PNP silicon 2N3740 and 2N3741 transistors. Four levels of product assurance (JAN, JANTX, JANTXV and JANS) are provided for each encapsulated device type as specified in MIL-PRF-19500/441 and two levels of product assurance (JANHC and JANKC) are provided for each unencapsulated device type as specified in MIL-PRF-19500/441. Provisions for radiation hardness assurance (RHA) to eight radiation levels is provided for quality levels JANTXV, JANS, JANHC, and JANKC. RHA level designators "M", "D", "P", "L", "R", "F", "G", and "H" are appended to the device prefix to identify devices, which have passed RHA requirements. The device package for the encapsulated device type are as follows: TO-66 and surface mount. The dimensions and topography for JANHC and JANKC unencapsulated die are as outlined in MIL-PRF-19500/441.

Documents

Technical documentation and resources