2147210070 - Zero-Hachi Header, 0.80mm Pitch, Single Row, Right-Angle, Surface Mount, Matte Tin (Sn) Plating, Friction Lock, 7 Circuits, Tape and Reel

Connectors, Interconnects

2147210130

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ZERO-HACHI HEADER, 0.80MM PITCH, SINGLE ROW, RIGHT-ANGLE, SURFACE MOUNT, MATTE TIN (SN) PLATING, FRICTION LOCK, 13 CIRCUITS, TAPE AND REEL

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Connectors, Interconnects

2147210130

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Molex

ZERO-HACHI HEADER, 0.80MM PITCH, SINGLE ROW, RIGHT-ANGLE, SURFACE MOUNT, MATTE TIN (SN) PLATING, FRICTION LOCK, 13 CIRCUITS, TAPE AND REEL

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Technical Specifications

Parameters and characteristics for this part

Specification	2147210130

Applications	Telecommunications, General Purpose
Connector Type	Header
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	1 µm
Contact Finish Thickness - Mating	39.4 µin
Contact Finish Thickness - Post	1 çm
Contact Finish Thickness - Post	39.4 çin
Contact Material	Copper Alloy
Contact Type	Forked
Fastening Type	Detent Lock
Features	Solder Retention
Insulation Color	Black
Insulation Height	0.063 in
Insulation Height	1.6 mm
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount, Right Angle
Number of Positions	13
Number of Positions Loaded	All
Number of Rows	1
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Pitch - Mating	0.031 in
Pitch - Mating	0.8 mm
Style	Board to Cable/Wire
Termination	Solder
Voltage Rating	30 VDC

214721 Series

Zero-Hachi Header, 0.80mm Pitch, Single Row, Right-Angle, Surface Mount, Gold (Au) Plating, Friction Lock, 15 Circuits, Tape and Reel

Part	Contact Type	Features	Operating Temperature [Max]	Operating Temperature [Min]	Contact Finish - Post	Contact Material	Insulation Color	Fastening Type	Connector Type	Mounting Type	Applications	Insulation Height	Insulation Height	Insulation Material	Current Rating (Amps)	Termination	Style	Number of Positions Loaded	Material Flammability Rating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Mating	Voltage Rating	Number of Rows	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions	Number of Positions
Molex 2147210030	Forked	Solder Retention	85 °C	-40 °C	Tin	Copper Alloy	Black	Detent Lock	Header	Surface Mount Right Angle	General Purpose Telecommunications	0.063 in	1.6 mm	Liquid Crystal Polymer (LCP)	1.5 A	Solder	Board to Cable/Wire	All	UL94 V-0	1 çm	39.4 çin	0.031 in	0.8 mm	30 VDC	1	1 µm	39.4 µin
Molex 2147210170	Forked	Solder Retention	85 °C	-40 °C	Tin	Copper Alloy	Black	Detent Lock	Header	Surface Mount Right Angle	General Purpose Telecommunications	0.063 in	1.6 mm	Liquid Crystal Polymer (LCP)		Solder	Board to Cable/Wire	All	UL94 V-0	1 çm	39.4 çin	0.031 in	0.8 mm	30 VDC	1	1 µm	39.4 µin
Molex 2147210190	Forked	Solder Retention	85 °C	-40 °C	Tin	Copper Alloy	Black	Detent Lock	Header	Surface Mount Right Angle	General Purpose Telecommunications	0.063 in	1.6 mm	Liquid Crystal Polymer (LCP)		Solder	Board to Cable/Wire	All	UL94 V-0	1 çm	39.4 çin	0.031 in	0.8 mm	30 VDC	1	1 µm	39.4 µin	19
Molex 2147210130	Forked	Solder Retention	85 °C	-40 °C	Tin	Copper Alloy	Black	Detent Lock	Header	Surface Mount Right Angle	General Purpose Telecommunications	0.063 in	1.6 mm	Liquid Crystal Polymer (LCP)		Solder	Board to Cable/Wire	All	UL94 V-0	1 çm	39.4 çin	0.031 in	0.8 mm	30 VDC	1	1 µm	39.4 µin	13
Molex 2147210140	Forked	Solder Retention	85 °C	-40 °C	Tin	Copper Alloy	Black	Detent Lock	Header	Surface Mount Right Angle	General Purpose Telecommunications	0.063 in	1.6 mm	Liquid Crystal Polymer (LCP)		Solder	Board to Cable/Wire	All	UL94 V-0	1 çm	39.4 çin	0.031 in	0.8 mm	30 VDC	1	1 µm	39.4 µin	14
Molex 2147210110	Forked	Solder Retention	85 °C	-40 °C	Tin	Copper Alloy	Black	Detent Lock	Header	Surface Mount Right Angle	General Purpose Telecommunications	0.063 in	1.6 mm	Liquid Crystal Polymer (LCP)		Solder	Board to Cable/Wire	All	UL94 V-0	1 çm	39.4 çin	0.031 in	0.8 mm	30 VDC	1	1 µm	39.4 µin	11
Molex 2147210020	Forked	Solder Retention	85 °C	-40 °C	Tin	Copper Alloy	Black	Detent Lock	Header	Surface Mount Right Angle	General Purpose Telecommunications	0.063 in	1.6 mm	Liquid Crystal Polymer (LCP)	1.5 A	Solder	Board to Cable/Wire	All	UL94 V-0	1 çm	39.4 çin	0.031 in	0.8 mm	30 VDC	1	1 µm	39.4 µin	2
Molex 2147210150	Forked	Solder Retention	85 °C	-40 °C	Tin	Copper Alloy	Black	Detent Lock	Header	Surface Mount Right Angle	General Purpose Telecommunications	0.063 in	1.6 mm	Liquid Crystal Polymer (LCP)		Solder	Board to Cable/Wire	All	UL94 V-0	1 çm	39.4 çin	0.031 in	0.8 mm	30 VDC	1	1 µm	39.4 µin	15
Molex 2147210120	Forked	Solder Retention	85 °C	-40 °C	Tin	Copper Alloy	Black	Detent Lock	Header	Surface Mount Right Angle	General Purpose Telecommunications	0.063 in	1.6 mm	Liquid Crystal Polymer (LCP)		Solder	Board to Cable/Wire	All	UL94 V-0	1 çm	39.4 çin	0.031 in	0.8 mm	30 VDC	1	1 µm	39.4 µin	12
Molex 2147210160	Forked	Solder Retention	85 °C	-40 °C	Tin	Copper Alloy	Black	Detent Lock	Header	Surface Mount Right Angle	General Purpose Telecommunications	0.063 in	1.6 mm	Liquid Crystal Polymer (LCP)		Solder	Board to Cable/Wire	All	UL94 V-0	1 çm	39.4 çin	0.031 in	0.8 mm	30 VDC	1	1 µm	39.4 µin		16

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	30000	$ 1.39

Description

General part information

214721 Series

Zero-Hachi Header, 0.80mm Pitch, Single Row, Right-Angle, Surface Mount, Gold (Au) Plating, Friction Lock, 15 Circuits, Tape and Reel

Documents

Technical documentation and resources

Drawing

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