Zero-Hachi Header, 0.80mm Pitch, Single Row, Right-Angle, Surface Mount, Gold (Au) Plating, Friction Lock, 15 Circuits, Tape and Reel
Zero-Hachi Header, 0.80mm Pitch, Single Row, Right-Angle, Surface Mount, Gold (Au) Plating, Friction Lock, 15 Circuits, Tape and Reel
Zero-Hachi Header, 0.80mm Pitch, Single Row, Right-Angle, Surface Mount, Gold (Au) Plating, Friction Lock, 15 Circuits, Tape and Reel
| Part | Contact Type | Features | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish - Post | Contact Material | Insulation Color | Fastening Type | Connector Type | Mounting Type | Applications | Insulation Height | Insulation Height | Insulation Material | Current Rating (Amps) | Termination | Style | Number of Positions Loaded | Material Flammability Rating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Mating | Pitch - Mating | Voltage Rating | Number of Rows | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions | Number of Positions |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Molex | Forked | Solder Retention | 85 °C | -40 °C | Tin | Copper Alloy | Black | Detent Lock | Header | Surface Mount Right Angle | General Purpose Telecommunications | 0.063 in | 1.6 mm | Liquid Crystal Polymer (LCP) | 1.5 A | Solder | Board to Cable/Wire | All | UL94 V-0 | 1 çm | 39.4 çin | 0.031 in | 0.8 mm | 30 VDC | 1 | 1 µm | 39.4 µin | ||
Molex | Forked | Solder Retention | 85 °C | -40 °C | Tin | Copper Alloy | Black | Detent Lock | Header | Surface Mount Right Angle | General Purpose Telecommunications | 0.063 in | 1.6 mm | Liquid Crystal Polymer (LCP) | Solder | Board to Cable/Wire | All | UL94 V-0 | 1 çm | 39.4 çin | 0.031 in | 0.8 mm | 30 VDC | 1 | 1 µm | 39.4 µin | |||
 Molex | Forked | Solder Retention | 85 °C | -40 °C | Tin | Copper Alloy | Black | Detent Lock | Header | Surface Mount Right Angle | General Purpose Telecommunications | 0.063 in | 1.6 mm | Liquid Crystal Polymer (LCP) | Solder | Board to Cable/Wire | All | UL94 V-0 | 1 çm | 39.4 çin | 0.031 in | 0.8 mm | 30 VDC | 1 | 1 µm | 39.4 µin | 19 | ||
 Molex | Forked | Solder Retention | 85 °C | -40 °C | Tin | Copper Alloy | Black | Detent Lock | Header | Surface Mount Right Angle | General Purpose Telecommunications | 0.063 in | 1.6 mm | Liquid Crystal Polymer (LCP) | Solder | Board to Cable/Wire | All | UL94 V-0 | 1 çm | 39.4 çin | 0.031 in | 0.8 mm | 30 VDC | 1 | 1 µm | 39.4 µin | 13 | ||
 Molex | Forked | Solder Retention | 85 °C | -40 °C | Tin | Copper Alloy | Black | Detent Lock | Header | Surface Mount Right Angle | General Purpose Telecommunications | 0.063 in | 1.6 mm | Liquid Crystal Polymer (LCP) | Solder | Board to Cable/Wire | All | UL94 V-0 | 1 çm | 39.4 çin | 0.031 in | 0.8 mm | 30 VDC | 1 | 1 µm | 39.4 µin | 14 | ||
Molex | Forked | Solder Retention | 85 °C | -40 °C | Tin | Copper Alloy | Black | Detent Lock | Header | Surface Mount Right Angle | General Purpose Telecommunications | 0.063 in | 1.6 mm | Liquid Crystal Polymer (LCP) | Solder | Board to Cable/Wire | All | UL94 V-0 | 1 çm | 39.4 çin | 0.031 in | 0.8 mm | 30 VDC | 1 | 1 µm | 39.4 µin | 11 | ||
 Molex | Forked | Solder Retention | 85 °C | -40 °C | Tin | Copper Alloy | Black | Detent Lock | Header | Surface Mount Right Angle | General Purpose Telecommunications | 0.063 in | 1.6 mm | Liquid Crystal Polymer (LCP) | 1.5 A | Solder | Board to Cable/Wire | All | UL94 V-0 | 1 çm | 39.4 çin | 0.031 in | 0.8 mm | 30 VDC | 1 | 1 µm | 39.4 µin | 2 | |
Molex | Forked | Solder Retention | 85 °C | -40 °C | Tin | Copper Alloy | Black | Detent Lock | Header | Surface Mount Right Angle | General Purpose Telecommunications | 0.063 in | 1.6 mm | Liquid Crystal Polymer (LCP) | Solder | Board to Cable/Wire | All | UL94 V-0 | 1 çm | 39.4 çin | 0.031 in | 0.8 mm | 30 VDC | 1 | 1 µm | 39.4 µin | 15 | ||
Molex | Forked | Solder Retention | 85 °C | -40 °C | Tin | Copper Alloy | Black | Detent Lock | Header | Surface Mount Right Angle | General Purpose Telecommunications | 0.063 in | 1.6 mm | Liquid Crystal Polymer (LCP) | Solder | Board to Cable/Wire | All | UL94 V-0 | 1 çm | 39.4 çin | 0.031 in | 0.8 mm | 30 VDC | 1 | 1 µm | 39.4 µin | 12 | ||
Molex | Forked | Solder Retention | 85 °C | -40 °C | Tin | Copper Alloy | Black | Detent Lock | Header | Surface Mount Right Angle | General Purpose Telecommunications | 0.063 in | 1.6 mm | Liquid Crystal Polymer (LCP) | Solder | Board to Cable/Wire | All | UL94 V-0 | 1 çm | 39.4 çin | 0.031 in | 0.8 mm | 30 VDC | 1 | 1 µm | 39.4 µin | 16 |