LMZ31530RLGT
Active3V TO 14.5V, 30A STEP-DOWN POWER MODULE IN 15X16X5.8MM QFN PACKAGE
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LMZ31530RLGT
Active3V TO 14.5V, 30A STEP-DOWN POWER MODULE IN 15X16X5.8MM QFN PACKAGE
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | LMZ31530RLGT |
|---|---|
| Applications | ITE (Commercial) |
| Current - Output (Max) [Max] | 30 A |
| Efficiency | 96 % |
| Features | Remote On/Off, UVLO, OCP, OTP |
| Mounting Type | Surface Mount |
| Number of Outputs | 1 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Package / Case | 72-BQFN Module |
| Size / Dimension [x] | 16.2 mm |
| Size / Dimension [x] | 0.64 in |
| Size / Dimension [y] | 15.2 mm |
| Size / Dimension [y] | 0.6 in |
| Size / Dimension [z] | 0.23 " |
| Size / Dimension [z] | 5.9 mm |
| Supplier Device Package | 72-BQFN (15x15) |
| Type | Non-Isolated PoL Module |
| Voltage - Input (Min) [Min] | 3 V |
| Voltage - Output 1 [Max] | 3.6 V |
| Voltage - Output 1 [Min] | 0.6 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 22.98 | |
| 5 | $ 22.80 | |||
| 10 | $ 22.62 | |||
| 25 | $ 22.27 | |||
| 50 | $ 21.21 | |||
| 100 | $ 19.44 | |||
| Digi-Reel® | 1 | $ 22.98 | ||
| 5 | $ 22.80 | |||
| 10 | $ 22.62 | |||
| 25 | $ 22.27 | |||
| 50 | $ 21.21 | |||
| 100 | $ 19.44 | |||
| Tape & Reel (TR) | 250 | $ 19.09 | ||
| 500 | $ 18.81 | |||
| Texas Instruments | SMALL T&R | 1 | $ 23.24 | |
| 100 | $ 20.30 | |||
| 250 | $ 15.65 | |||
| 1000 | $ 14.00 | |||
Description
General part information
LMZ31530 Series
The LMZ31530 power module is an easy-to-use integrated power solution that combines a 30-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process.
The 15 × 16 × 5.8 mm, QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design. Achieves greater than 95% efficiency, has ultra-fast load step response and excellent power dissipation capability with a thermal impedance of 8.6°C/W. The LMZ31530 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering a wide range of ICs and systems. Advanced packaging technology affords a robust and reliable power solution compatible with standard QFN mounting and testing techniques.
The LMZ31530 power module is an easy-to-use integrated power solution that combines a 30-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process.
Documents
Technical documentation and resources