
LMZ31530 Series
3V to 14.5V, 30A Step-Down Power Module in 15x16x5.8mm QFN Package
Manufacturer: Texas Instruments
Catalog
3V to 14.5V, 30A Step-Down Power Module in 15x16x5.8mm QFN Package
Key Features
• Complete Integrated Power Solution;Smaller than a Discrete Design15 mm × 16 mm × 5.8 mm Package Size- Pin Compatible with LMZ31520Ultra-Fast Load Step ResponseEfficiencies Up To 96%Wide-Output Voltage Adjust0.6 V to 3.6 V, with 1% Reference AccuracyOptional Split Power Rails AllowsInput Voltage Down to 3 VSelectable Switching Frequency;(300 kHz to 850 kHz)Selectable Slow-StartAdjustable Over Current LimitPower Good OutputOutput Voltage SequencingOver Temperature ProtectionPre-bias Output Start-upOperating Temperature Range: –40°C to 85°CEnhanced Thermal Performance: 8.6°C/WMeets EN55022 Class A Emissions- Integrated Shielded InductorCreate a Custom Design Using the LMZ31530 With theWEBENCH®Power DesignerComplete Integrated Power Solution;Smaller than a Discrete Design15 mm × 16 mm × 5.8 mm Package Size- Pin Compatible with LMZ31520Ultra-Fast Load Step ResponseEfficiencies Up To 96%Wide-Output Voltage Adjust0.6 V to 3.6 V, with 1% Reference AccuracyOptional Split Power Rails AllowsInput Voltage Down to 3 VSelectable Switching Frequency;(300 kHz to 850 kHz)Selectable Slow-StartAdjustable Over Current LimitPower Good OutputOutput Voltage SequencingOver Temperature ProtectionPre-bias Output Start-upOperating Temperature Range: –40°C to 85°CEnhanced Thermal Performance: 8.6°C/WMeets EN55022 Class A Emissions- Integrated Shielded InductorCreate a Custom Design Using the LMZ31530 With theWEBENCH®Power Designer
Description
AI
The LMZ31530 power module is an easy-to-use integrated power solution that combines a 30-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process.
The 15 × 16 × 5.8 mm, QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design. Achieves greater than 95% efficiency, has ultra-fast load step response and excellent power dissipation capability with a thermal impedance of 8.6°C/W. The LMZ31530 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering a wide range of ICs and systems. Advanced packaging technology affords a robust and reliable power solution compatible with standard QFN mounting and testing techniques.
The LMZ31530 power module is an easy-to-use integrated power solution that combines a 30-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process.
The 15 × 16 × 5.8 mm, QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design. Achieves greater than 95% efficiency, has ultra-fast load step response and excellent power dissipation capability with a thermal impedance of 8.6°C/W. The LMZ31530 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering a wide range of ICs and systems. Advanced packaging technology affords a robust and reliable power solution compatible with standard QFN mounting and testing techniques.