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BA17818FP-E2
Discrete Semiconductor Products

R8003KND3TL1

Active
Rohm Semiconductor

HIGH-SPEED SWITCHING, NCH 800V 3A, TO-252 (DPAK), POWER MOSFET

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BA17818FP-E2
Discrete Semiconductor Products

R8003KND3TL1

Active
Rohm Semiconductor

HIGH-SPEED SWITCHING, NCH 800V 3A, TO-252 (DPAK), POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationR8003KND3TL1
Current - Continuous Drain (Id) @ 25°C3 A
Drain to Source Voltage (Vdss)800 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs11.5 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]300 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSC-63, DPAK (2 Leads + Tab), TO-252-3
Power Dissipation (Max)45 W
Rds On (Max) @ Id, Vgs [Max]1.8 Ohm
Supplier Device PackageTO-252
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id4.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 3.06
10$ 1.99
100$ 1.38
500$ 1.11
1000$ 1.03
Digi-Reel® 1$ 2.23
10$ 1.85
100$ 1.47
500$ 1.25
1000$ 1.06
Tape & Reel (TR) 2500$ 0.94

Description

General part information

R8003KND3 Series

The R8xxxKNx series are high-speed switching products, Super Junction MOSFETs, that place an emphasis on high efficiency. This series products achieve higher efficiency via high-speed switching. High-speed switching makes it possible to contribute to higher efficiency in PFC and LLC circuits.

Documents

Technical documentation and resources

What is a Thermal Model? (Transistor)

Thermal Design

Package Dimensions

Package Information

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Part Explanation

Application Note

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Types and Features of Transistors

Application Note

What Is Thermal Design

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

Explanation for Marking

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

About Export Regulations

Export Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Reliability Test Result

Manufacturing Data

Moisture Sensitivity Level - Transistors

Package Information

PCB Layout Thermal Design Guide

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design