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22-VSON-CLIP
Discrete Semiconductor Products

CSD88584Q5DCT

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Texas Instruments

40-V, N CHANNEL SYNCHRONOUS BUCK NEXFET™ POWER MOSFET, SON 5 MM X 6 MM DUAL-COOL™ POWER BLOCK, 50 A

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22-VSON-CLIP
Discrete Semiconductor Products

CSD88584Q5DCT

Active
Texas Instruments

40-V, N CHANNEL SYNCHRONOUS BUCK NEXFET™ POWER MOSFET, SON 5 MM X 6 MM DUAL-COOL™ POWER BLOCK, 50 A

Technical Specifications

Parameters and characteristics for this part

SpecificationCSD88584Q5DCT
Configuration2 N-Channel (Half Bridge)
Drain to Source Voltage (Vdss)40 V
Input Capacitance (Ciss) (Max) @ Vds12400 pF
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-55 °C
Package / Case22-PowerTFDFN
Power - Max [Max]12 W
Rds On (Max) @ Id, Vgs0.95 mOhm
Supplier Device Package22-VSON-CLIP (5x6)
TechnologyMOSFET (Metal Oxide)
Vgs(th) (Max) @ Id2.3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 4.53
10$ 3.81
100$ 3.08
Digi-Reel® 1$ 4.53
10$ 3.81
100$ 3.08
Tape & Reel (TR) 250$ 2.03
Texas InstrumentsSMALL T&R 1$ 3.42
100$ 3.00
250$ 2.10
1000$ 1.69

Description

General part information

CSD88584Q5DC Series

The CSD88584Q5DC 40V power block is an optimized design for high-current motor control applications, such as handheld, cordless garden and power tools. This device utilizes TI’s patented stacked die technology in order to minimize parasitic inductances while offering a complete half bridge in a space saving thermally enhanced DualCool™ 5mm × 6mm package. With an exposed metal top, this power block device allows for simple heat sink application to draw heat out through the top of the package and away from the PCB, for superior thermal performance at the higher currents demanded by many motor control applications.

The CSD88584Q5DC 40V power block is an optimized design for high-current motor control applications, such as handheld, cordless garden and power tools. This device utilizes TI’s patented stacked die technology in order to minimize parasitic inductances while offering a complete half bridge in a space saving thermally enhanced DualCool™ 5mm × 6mm package. With an exposed metal top, this power block device allows for simple heat sink application to draw heat out through the top of the package and away from the PCB, for superior thermal performance at the higher currents demanded by many motor control applications.