CSD88584Q5DC Series

40-V, N channel synchronous buck NexFET™ power MOSFET, SON 5 mm x 6 mm Dual-Cool™ power block, 50 A

Catalog

40-V, N channel synchronous buck NexFET™ power MOSFET, SON 5 mm x 6 mm Dual-Cool™ power block, 50 A

Part	Rds On (Max) @ Id, Vgs	Configuration	Drain to Source Voltage (Vdss)	Input Capacitance (Ciss) (Max) @ Vds	Vgs(th) (Max) @ Id	Technology	Power - Max [Max]	Mounting Type	Supplier Device Package	Package / Case	Operating Temperature [Min]	Operating Temperature [Max]
Texas Instruments CSD88584Q5DCT	0.95 mOhm	2 N-Channel (Half Bridge)	40 V	12400 pF	2.3 V	MOSFET (Metal Oxide)	12 W	Surface Mount	22-VSON-CLIP (5x6)	22-PowerTFDFN	-55 °C	150 °C

Catalog

40-V, N channel synchronous buck NexFET™ power MOSFET, SON 5 mm x 6 mm Dual-Cool™ power block, 50 A

Key Features

• Half-bridge power blockHigh-density SON 5mm × 6mm footprintLow RDS(ON) for minimized conduction losses2.4W PLoss at 35ADualCool™ thermally enhanced packageUltra-low-inductance packageRoHS compliantHalogen freeLead-free terminal platingHalf-bridge power blockHigh-density SON 5mm × 6mm footprintLow RDS(ON) for minimized conduction losses2.4W PLoss at 35ADualCool™ thermally enhanced packageUltra-low-inductance packageRoHS compliantHalogen freeLead-free terminal plating

Description

The CSD88584Q5DC 40V power block is an optimized design for high-current motor control applications, such as handheld, cordless garden and power tools. This device utilizes TI’s patented stacked die technology in order to minimize parasitic inductances while offering a complete half bridge in a space saving thermally enhanced DualCool™ 5mm × 6mm package. With an exposed metal top, this power block device allows for simple heat sink application to draw heat out through the top of the package and away from the PCB, for superior thermal performance at the higher currents demanded by many motor control applications. The CSD88584Q5DC 40V power block is an optimized design for high-current motor control applications, such as handheld, cordless garden and power tools. This device utilizes TI’s patented stacked die technology in order to minimize parasitic inductances while offering a complete half bridge in a space saving thermally enhanced DualCool™ 5mm × 6mm package. With an exposed metal top, this power block device allows for simple heat sink application to draw heat out through the top of the package and away from the PCB, for superior thermal performance at the higher currents demanded by many motor control applications.