Deep-Dive with AI
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Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | OMAP3503ECBBA |
|---|---|
| Additional Interfaces | I2C, HDQ/1-Wire, McSPI, MMC/SD/SDIO, McBSP, UART |
| Co-Processors/DSP | NEON™ SIMD, Multimedia |
| Core Processor | ARM® Cortex®-A8 |
| Display & Interface Controllers | LCD |
| Graphics Acceleration | False |
| Mounting Type | Surface Mount |
| Number of Cores/Bus Width | 32 Bit, 1 Core |
| Operating Temperature [custom] | -40 °C, 105 °C |
| Package / Case | FCBGA, 515-VFBGA |
| RAM Controllers | LPDDR |
| Speed | 600 MHz |
| Supplier Device Package | 515-POP-FCBGA (12x12) |
| USB | USB 2.0 (1), USB 1.x (3) |
| Voltage - I/O | 3 V, 1.8 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tray | 168 | $ 35.63 | |
| Texas Instruments | JEDEC TRAY (5+1) | 1 | $ 40.32 | |
| 100 | $ 35.84 | |||
| 250 | $ 29.46 | |||
| 1000 | $ 26.35 | |||
Description
General part information
OMAP3503 Series
devices are based on the enhanced OMAP 3 architecture.
The OMAP 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following:
The device supports high-level operating systems (HLOSs), such as:
Documents
Technical documentation and resources
