Specification	8000-410-LF

Board Thickness	0.062 in
Circuit Pattern	Pad Per Hole (Round)
Hole Diameter	0.037 in
Pitch	0.1 in
Proto Board Type	General Purpose, Breadboard
Size / Dimension Length	10 in
Size / Dimension Width	4 in

8000 Series

Part	Hole Diameter	Proto Board Type	Board Thickness	Size / Dimension Length	Size / Dimension Width	Circuit Pattern	Pitch
TWIN INDUSTRIES 8000-4565-LF	0.037 in	Breadboard General Purpose	0.062 in	6.5 in	114.3 mm	Pad Per Hole (Round)	0.1 in
TWIN INDUSTRIES 8000-45	0.037 in	Breadboard General Purpose	0.062 in	5 in	4 in	Pad Per Hole (Round)	0.1 in
TWIN INDUSTRIES 8000-1020	0.037 in	Breadboard General Purpose	0.062 in	20 in	10 in	Pad Per Hole (Round)	0.1 in
TWIN INDUSTRIES 8000-1010-LF	0.037 in	Breadboard General Purpose	0.062 in	10 in	10 in	Pad Per Hole (Round)	0.1 in
TWIN INDUSTRIES 8000-410-LF	0.037 in	Breadboard General Purpose	0.062 in	10 in	4 in	Pad Per Hole (Round)	0.1 in
TWIN INDUSTRIES 8000-1010	0.037 in	Breadboard General Purpose	0.062 in	10 in	10 in	Pad Per Hole (Round)	0.1 in
TWIN INDUSTRIES 8000-45-LF	0.037 in	Breadboard General Purpose	0.062 in	5 in	4 in	Pad Per Hole (Round)	0.1 in
TWIN INDUSTRIES 8000-410	0.037 in	Breadboard General Purpose	0.062 in	10 in	4 in	Pad Per Hole (Round)	0.1 in
TWIN INDUSTRIES 8000-2MM-3U		Breadboard General Purpose		6.3 in	3.94 in	Pad Per Hole (Round)	0.079 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$	Updated

Digikey	Bulk	1	$ 25.50	<2d
		5	$ 24.99
		10	$ 24.48
		25	$ 23.97
		50	$ 23.46
Newark	Each	1	$ 25.50	1m+
		5	$ 24.99
		10	$ 24.48
		25	$ 23.97
		50	$ 23.46

CAD

3D models and CAD resources for this part

Description

General part information

8000 Series

The 8000-410-LF is a Prototyping Board made of epoxy glass composite. Standard tin/lead solder finish has been replaced with gold plating. Lead-free boards are useful for developing new lead-free products, transitioning existing products to lead-free versions and for developing lead-free solder/assembly techniques.

Documents

Technical documentation and resources

8000-410-LF | Datasheet

Datasheet

Technical Data Sheet EN

Datasheet