Integrated Circuits (ICs)

MPC8270CZQMIBA

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MICROPROCESSOR, 1 CORE, 32-BIT, POWERPC G2_LE, 266 MHZ, PBGA, 516 PINS

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Integrated Circuits (ICs)

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MICROPROCESSOR, 1 CORE, 32-BIT, POWERPC G2_LE, 266 MHZ, PBGA, 516 PINS

Technical Specifications

Parameters and characteristics for this part

Part	Voltage - I/O	USB	Speed	Additional Interfaces	Supplier Device Package	RAM Controllers	Ethernet	Ethernet [Max]	Ethernet [Min]	Core Processor	Co-Processors/DSP	Mounting Type	Number of Cores/Bus Width	Package / Case	Operating Temperature [Max]	Operating Temperature [Min]	Supplier Device Package [x]	Supplier Device Package [y]
Freescale Semiconductor - NXP MPC8270CZQMIBA	3.3 V	USB 2.0 (1)	333 MHz	I2C SCC SMC SPI UART USART	516-PBGA (27x27)	DRAM SDRAM	(3)	100 Mbps	10 Mbps	PowerPC G2_LE	Communications RISC CPM	Surface Mount	1 Core 32 Bit	516-BBGA	105 °C	-40 °C
Freescale Semiconductor - NXP MPC8270CZUUPEA	3.3 V	USB 2.0 (1)	450 MHz	I2C SCC SMC SPI UART USART	480-TBGA	DRAM SDRAM	(3)	100 Mbps	10 Mbps	PowerPC G2_LE	Communications RISC CPM	Surface Mount	1 Core 32 Bit	480-LBGA Exposed Pad	105 °C	-40 °C	37.5	37.5
Freescale Semiconductor - NXP MPC8270VRMIBA	3.3 V	USB 2.0 (1)	266 MHz	I2C SCC SMC SPI UART USART	516-PBGA (27x27)	DRAM SDRAM	(3)	100 Mbps	10 Mbps	PowerPC G2_LE	Communications RISC CPM	Surface Mount	1 Core 32 Bit	516-BBGA	105 °C	0 °C

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

266 MHz CPU, 200 MHz CPM, 66 MHz bus

~ 1W @ full performance, 1.5V

HIP7AP .13 micron, 3.3V I/O, 1.5V Core

Technical documentation and resources