MPC8270 Series
Manufacturer: Freescale Semiconductor - NXP
MICROPROCESSOR, 1 CORE, 32-BIT, POWERPC G2_LE, 266 MHZ, PBGA, 516 PINS
| Part | Graphics Acceleration | Voltage - I/O | USB | Speed | Additional Interfaces | Supplier Device Package | RAM Controllers | Ethernet | Ethernet [Max] | Ethernet [Min] | Core Processor | Co-Processors/DSP | Mounting Type | Number of Cores/Bus Width | Package / Case | Operating Temperature [Max] | Operating Temperature [Min] | Supplier Device Package [x] | Supplier Device Package [y] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Freescale Semiconductor - NXP | 3.3 V | USB 2.0 (1) | 333 MHz | I2C SCC SMC SPI UART USART | 516-PBGA (27x27) | DRAM SDRAM | (3) | 100 Mbps | 10 Mbps | PowerPC G2_LE | Communications RISC CPM | Surface Mount | 1 Core 32 Bit | 516-BBGA | 105 °C | -40 °C | |||
Freescale Semiconductor - NXP | 3.3 V | USB 2.0 (1) | 450 MHz | I2C SCC SMC SPI UART USART | 480-TBGA | DRAM SDRAM | (3) | 100 Mbps | 10 Mbps | PowerPC G2_LE | Communications RISC CPM | Surface Mount | 1 Core 32 Bit | 480-LBGA Exposed Pad | 105 °C | -40 °C | 37.5 | 37.5 | |
Freescale Semiconductor - NXP | 3.3 V | USB 2.0 (1) | 266 MHz | I2C SCC SMC SPI UART USART | 516-PBGA (27x27) | DRAM SDRAM | (3) | 100 Mbps | 10 Mbps | PowerPC G2_LE | Communications RISC CPM | Surface Mount | 1 Core 32 Bit | 516-BBGA | 105 °C | 0 °C |