Specification	10-350000-10-HT

Board Material	Polyimide (PI)
Board Thickness	1.57 mm
Board Thickness	0.062 "
Contact Finish - Post	Tin-Lead
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Post [custom]	Brass
Convert From (Adapter End)	SOIC
Convert To (Adapter End)	7.62 mm
Convert To (Adapter End)	DIP
Convert To (Adapter End)	0.3 in
Material	FR4 Epoxy Glass
Mounting Type	Through Hole
Number of Pins	10
Number of Positions	10
Package Accepted	SOIC
Pitch	0.05 in
Pitch	1.27 mm
Pitch - Mating	1.27 mm
Pitch - Mating	0.05 in
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Proto Board Type	DIP to DIP
Termination	Solder
Termination Post Length	0.125 in
Termination Post Length	3.18 mm

10-3500 Series

Part	Material	Number of Positions	Proto Board Type	Pitch	Pitch	Board Thickness	Board Thickness	Board Thickness	Termination Post Length	Termination Post Length	Number of Pins	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Convert From (Adapter End)	Contact Material - Post [custom]	Mounting Type	Pitch - Mating	Pitch - Mating	Board Material	Termination	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Pitch - Post	Pitch - Post	Package Accepted
Aries Electronics 10-350000-10	FR4 Epoxy Glass	10	SMD to DIP	0.05 in	1.27 mm	1.57 mm	0.062 "	0.0625 in
Aries Electronics 10-350000-10-HT	FR4 Epoxy Glass	10	DIP to DIP	0.05 in	1.27 mm	1.57 mm	0.062 "		0.125 in	3.18 mm	10	200 µin	5.08 µm	Tin-Lead	SOIC	Brass	Through Hole	1.27 mm	0.05 in	Polyimide (PI)	Solder	7.62 mm	DIP	0.3 in	0.1 in	2.54 mm	SOIC

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly