MSP430FR2633IRHBT
ActiveCAPACITIVE TOUCH MCU WITH 16 TOUCH IO (64 SENSORS), 16KB FRAM, 4KB SRAM, 19 IO, 10-BIT ADC
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MSP430FR2633IRHBT
ActiveCAPACITIVE TOUCH MCU WITH 16 TOUCH IO (64 SENSORS), 16KB FRAM, 4KB SRAM, 19 IO, 10-BIT ADC
Technical Specifications
Parameters and characteristics for this part
| Specification | MSP430FR2633IRHBT |
|---|---|
| Connectivity | IrDA, UART/USART, SCI, SPI, I2C |
| Core Processor | MSP430 CPU16 |
| Core Size | 16-Bit |
| Data Converters [custom] | 8 |
| Data Converters [custom] | 10 |
| Mounting Type | Surface Mount |
| Number of I/O | 19 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Oscillator Type | Internal |
| Package / Case | 32-VFQFN Exposed Pad |
| Program Memory Size | 15.5 KB |
| Program Memory Type | FRAM |
| RAM Size | 4K x 8 |
| Speed | 16 MHz |
| Supplier Device Package | 32-VQFN (5x5) |
| Voltage - Supply (Vcc/Vdd) [Max] | 3.6 V |
| Voltage - Supply (Vcc/Vdd) [Min] | 1.8 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 5.68 | |
| 10 | $ 5.11 | |||
| 25 | $ 4.83 | |||
| 100 | $ 4.18 | |||
| Digi-Reel® | 1 | $ 5.68 | ||
| 10 | $ 5.11 | |||
| 25 | $ 4.83 | |||
| 100 | $ 4.18 | |||
| Tape & Reel (TR) | 250 | $ 3.97 | ||
| 500 | $ 3.56 | |||
| 1250 | $ 3.00 | |||
| 2500 | $ 2.85 | |||
| Texas Instruments | SMALL T&R | 1 | $ 4.76 | |
| 100 | $ 3.93 | |||
| 250 | $ 2.82 | |||
| 1000 | $ 2.12 | |||
Description
General part information
MSP430FR2633 Series
The MSP430FR263x and MSP430FR253x are ultra-low-power MSP430™ microcontrollers for capacitive touch sensing that featureCapTIvate™ touch technologyfor buttons, sliders, wheels, and proximity applications. MSP430 MCUs with CapTIvate technology provide the most integrated and autonomous capacitive-touch solution in the market with high reliability and noise immunity at the lowest power. TI’s capacitive touch technology supports concurrent self-capacitance and mutual-capacitance electrodes on the same design for maximum flexibility. MSP430 MCUs with CapTIvate technology operate through thick glass, plastic enclosures, metal, and wood with operation in harsh environments including wet, greasy, and dirty environments.
TI capacitive touch sensing MSP430 MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get your design started quickly. Development kits include theMSP-CAPT-FR2633 CapTIvate technology development kit. TI also provides free software including theCapTIvate Design Center, where engineers can quickly develop applications with an easy-to-use GUI andMSP430Ware™ softwareand comprehensive documentation with theCapTIvate Technology Guide.
TI’s MSP430 ultra-low-power (ULP) FRAM microcontroller platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing system designers to increase performance while lowering energy consumption. FRAM technology combines the low-energy fast writes, flexibility, and endurance of RAM with the nonvolatility of flash.
Documents
Technical documentation and resources
