Specification	RFN10NS4STL

Current - Average Rectified (Io)	10 A
Current - Reverse Leakage @ Vr	10 µA
Mounting Type	Surface Mount
Operating Temperature - Junction	150 ¯C
Package / Case	D2PAK (2 Leads + Tab), TO-263-3, TO-263AB
Reverse Recovery Time (trr)	30 ns
Speed	500 ns, 200 mA
Supplier Device Package	LPDS
Technology	Standard
Voltage - DC Reverse (Vr) (Max) [Max]	430 V
Voltage - Forward (Vf) (Max) @ If	1.55 V

RFN10 Series

Super Fast Recovery Diode (AEC-Q101 Qualified)

Part	Operating Temperature - Junction [Max]	Current - Reverse Leakage @ Vr	Voltage - Forward (Vf) (Max) @ If	Mounting Type	Package / Case	Grade	Voltage - DC Reverse (Vr) (Max) [Max]	Qualification	Speed	Supplier Device Package	Reverse Recovery Time (trr)	Current - Average Rectified (Io)	Technology	Operating Temperature - Junction	Current - Average Rectified (Io) (per Diode)	Voltage - Forward (Vf) (Max) @ If [Max]	Diode Configuration
Rohm Semiconductor RFN10TF6SFHC9	150 °C	10 µA	1.55 V	Through Hole	TO-220-2 Full Pack	Automotive	600 V	AEC-Q101	200 mA 500 ns	TO-220NFM	50 ns	10 A	Standard
Rohm Semiconductor RFN10T2DNZC9		10 ÁA		Through Hole	TO-220-3 Full Pack		200 V		200 mA 500 ns	TO-220FN	25 ns		Standard	150 ¯C	10 A	980 mV	1 Pair Common Cathode
Rohm Semiconductor RFN10NS8DTL		10 µA	2.1 V	Surface Mount	D2PAK (2 Leads + Tab) TO-263-3 TO-263AB		800 V		200 mA 500 ns	LPDS	40 ns		Standard	150 ¯C	10 A		1 Pair Common Cathode
Rohm Semiconductor RFN10BGE6STL		10 µA	1.55 V	Surface Mount	DPAK (2 Leads + Tab) SC-63 TO-252-3		600 V		200 mA 500 ns	TO-252GE	50 ns	10 A	Standard	150 ¯C
Rohm Semiconductor RFN10BGE3STL		10 µA		Surface Mount	DPAK (2 Leads + Tab) SC-63 TO-252-3		350 V		200 mA 500 ns	TO-252GE	30 ns	10 A	Standard	150 ¯C		1.5 V
Rohm Semiconductor RFN10T2D	150 °C	10 ÁA		Through Hole	TO-220-3 Full Pack		200 V		200 mA 500 ns	TO-220FN	25 ns		Standard		5 A	980 mV	1 Pair Common Cathode
Rohm Semiconductor RFN10TF6SC9		10 µA	1.55 V	Through Hole	TO-220-2 Full Pack		600 V		200 mA 500 ns	TO-220NFM	50 ns	10 A	Standard	150 ¯C
Rohm Semiconductor RFN10BM6SFHTL	150 °C	10 µA	1.55 V	Surface Mount	DPAK (2 Leads + Tab) SC-63 TO-252-3	Automotive	600 V	AEC-Q101	200 mA 500 ns	TO-252	50 ns	10 A	Standard
Rohm Semiconductor RFN10NS4STL		10 µA	1.55 V	Surface Mount	D2PAK (2 Leads + Tab) TO-263-3 TO-263AB		430 V		200 mA 500 ns	LPDS	30 ns	10 A	Standard	150 ¯C
Rohm Semiconductor RFN10BM6STL		10 µA	1.55 V	Surface Mount	DPAK (2 Leads + Tab) SC-63 TO-252-3		600 V		200 mA 500 ns	TO-252	50 ns	10 A	Standard	150 ¯C

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 1.95
		10	$ 1.26
		100	$ 0.87
		500	$ 0.82
	Digi-Reel®	1	$ 1.37
		10	$ 1.14
		100	$ 0.91
		500	$ 0.82
	N/A	979	$ 1.91
	Tape & Reel (TR)	1000	$ 0.82

Description

General part information

RFN10 Series

ROHM's fast recovery diodes are ultra high-speed, low VF, and suited for significant efficiency increase of switching power supply as well as reduction of switching loss.

Documents

Technical documentation and resources

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Diode Types and Applications

Technical Article

How to Create Symbols for PSpice Models

Models

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

About Export Regulations

Export Information

Report of SVHC under REACH Regulation

Environmental Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Constitution Materials List

Environmental Data

RFN10NS4STL

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RFN10NS4STL

Deep-Dive with AI

Technical Specifications

RFN10 Series

Pricing

Description

RFN10 Series

Documents

Judgment Criteria of Thermal Evaluation

What is a Thermal Model? (Diode)

Reliability Test Result

Anti-Whisker formation - Diodes

Importance of Probe Calibration When Measuring Power: Deskew

Compliance of the RoHS directive

Two-Resistor Model for Thermal Simulation

Notes for Calculating Power Consumption:Static Operation

Method for Monitoring Switching Waveform

ESD Data

List of Diode Package Thermal Resistance

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Inner Structure

How to Select Rectifier Diodes

Part Explanation

Basics of Thermal Resistance and Heat Dissipation

RFN10NS4S Data Sheet

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Notes for Temperature Measurement Using Forward Voltage of PN Junction

PCB Layout Thermal Design Guide

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Notes for Temperature Measurement Using Thermocouples

How to Use LTspice&reg; Models: Tips for Improving Convergence

How to Use LTspice&reg; Models

Precautions When Measuring the Rear of the Package with a Thermocouple

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

What Is Thermal Design

Power Loss and Thermal Design of Diodes

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Absolute Maximum Rating and Electrical Characteristics of Diodes

Diode Types and Applications

How to Create Symbols for PSpice Models

How to Select Reverse Current Protection Diodes for LDO Regulators

Impedance Characteristics of Bypass Capacitor

About Export Regulations

Report of SVHC under REACH Regulation

Measurement Method and Usage of Thermal Resistance RthJC

Constitution Materials List

RFN10 Series

How to Use LTspice® Models: Tips for Improving Convergence

How to Use LTspice® Models