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353_TO220-3_TO220AB__3
Discrete Semiconductor Products

RFN10T2DNZC9

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Rohm Semiconductor

DIODE ARRAY GP 200V 10A TO220FN

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353_TO220-3_TO220AB__3
Discrete Semiconductor Products

RFN10T2DNZC9

Active
Rohm Semiconductor

DIODE ARRAY GP 200V 10A TO220FN

Technical Specifications

Parameters and characteristics for this part

SpecificationRFN10T2DNZC9
Current - Average Rectified (Io) (per Diode)10 A
Current - Reverse Leakage @ Vr10 ÁA
Diode Configuration1 Pair Common Cathode
Mounting TypeThrough Hole
Operating Temperature - Junction150 ¯C
Package / CaseTO-220-3 Full Pack
Reverse Recovery Time (trr)25 ns
Speed500 ns, 200 mA
Supplier Device PackageTO-220FN
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]200 V
Voltage - Forward (Vf) (Max) @ If [Max]980 mV

RFN10 Series

Super Fast Recovery Diode (AEC-Q101 Qualified)

PartOperating Temperature - Junction [Max]Current - Reverse Leakage @ VrVoltage - Forward (Vf) (Max) @ IfMounting TypePackage / CaseGradeVoltage - DC Reverse (Vr) (Max) [Max]QualificationSpeedSupplier Device PackageReverse Recovery Time (trr)Current - Average Rectified (Io)TechnologyOperating Temperature - JunctionCurrent - Average Rectified (Io) (per Diode)Voltage - Forward (Vf) (Max) @ If [Max]Diode Configuration
Product thumbnail image
Rohm Semiconductor
150 °C
10 µA
1.55 V
Through Hole
TO-220-2 Full Pack
Automotive
600 V
AEC-Q101
200 mA
500 ns
TO-220NFM
50 ns
10 A
Standard
353_TO220-3_TO220AB__3
Rohm Semiconductor
10 ÁA
Through Hole
TO-220-3 Full Pack
200 V
200 mA
500 ns
TO-220FN
25 ns
Standard
150 ¯C
10 A
980 mV
1 Pair Common Cathode
RFN10NS8DTL
Rohm Semiconductor
10 µA
2.1 V
Surface Mount
D2PAK (2 Leads + Tab)
TO-263-3
TO-263AB
800 V
200 mA
500 ns
LPDS
40 ns
Standard
150 ¯C
10 A
1 Pair Common Cathode
ROHM RB098BGE-30TL
Rohm Semiconductor
10 µA
1.55 V
Surface Mount
DPAK (2 Leads + Tab)
SC-63
TO-252-3
600 V
200 mA
500 ns
TO-252GE
50 ns
10 A
Standard
150 ¯C
ROHM RB098BGE-30TL
Rohm Semiconductor
10 µA
Surface Mount
DPAK (2 Leads + Tab)
SC-63
TO-252-3
350 V
200 mA
500 ns
TO-252GE
30 ns
10 A
Standard
150 ¯C
1.5 V
TO-220FN
Rohm Semiconductor
150 °C
10 ÁA
Through Hole
TO-220-3 Full Pack
200 V
200 mA
500 ns
TO-220FN
25 ns
Standard
5 A
980 mV
1 Pair Common Cathode
Product thumbnail image
Rohm Semiconductor
10 µA
1.55 V
Through Hole
TO-220-2 Full Pack
600 V
200 mA
500 ns
TO-220NFM
50 ns
10 A
Standard
150 ¯C
BA17818FP-E2
Rohm Semiconductor
150 °C
10 µA
1.55 V
Surface Mount
DPAK (2 Leads + Tab)
SC-63
TO-252-3
Automotive
600 V
AEC-Q101
200 mA
500 ns
TO-252
50 ns
10 A
Standard
RFNXXNXXXXX
Rohm Semiconductor
10 µA
1.55 V
Surface Mount
D2PAK (2 Leads + Tab)
TO-263-3
TO-263AB
430 V
200 mA
500 ns
LPDS
30 ns
10 A
Standard
150 ¯C
Product thumbnail image
Rohm Semiconductor
10 µA
1.55 V
Surface Mount
DPAK (2 Leads + Tab)
SC-63
TO-252-3
600 V
200 mA
500 ns
TO-252
50 ns
10 A
Standard
150 ¯C

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 894$ 1.79
Tube 1$ 1.28
50$ 1.03
100$ 0.85
500$ 0.77

Description

General part information

RFN10 Series

ROHM's fast recovery diodes are ultra high-speed, low VF, and suited for significant efficiency increase of switching power supply as well as reduction of switching loss.

Documents

Technical documentation and resources

What Is Thermal Design

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Anti-Whisker formation - Diodes

Package Information

How to Select Rectifier Diodes

Technical Article

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

Two-Resistor Model for Thermal Simulation

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

About Flammability of Materials

Environmental Data

Taping Information

Package Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

What is a Thermal Model? (Diode)

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Diode Types and Applications

Technical Article

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

RFN10T2DNZ ESD Data

Characteristics Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Compliance of the RoHS directive

Environmental Data

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Package Dimensions

Package Information

Moisture Sensitivity Level - Diodes

Package Information

RFN10T2DNZ Data Sheet

Data Sheet

How to Use LTspice&reg; Models

Schematic Design & Verification

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

Part Explanation

Application Note

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

List of Diode Package Thermal Resistance

Thermal Design

About Export Regulations

Export Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Inner Structure

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Explanation for Marking

Package Information