Zenode.ai Logo
Beta
LITTELFUSE LJ6008D8TP
Discrete Semiconductor Products

RFV8BM6STL

Obsolete
Rohm Semiconductor

RECTIFIERS RFV8BM6S IS HYPER FAST RECOVERY HARD RECOVERY TYPE SCHOTTKEY BARRIER DIODE FOR GENERAL RECTIFICATION.

Deep-Dive with AI

Search across all available documentation for this part.

LITTELFUSE LJ6008D8TP
Discrete Semiconductor Products

RFV8BM6STL

Obsolete
Rohm Semiconductor

RECTIFIERS RFV8BM6S IS HYPER FAST RECOVERY HARD RECOVERY TYPE SCHOTTKEY BARRIER DIODE FOR GENERAL RECTIFICATION.

Technical Specifications

Parameters and characteristics for this part

SpecificationRFV8BM6STL
Current - Average Rectified (Io)8 A
Current - Reverse Leakage @ Vr10 µA
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]150 °C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
Reverse Recovery Time (trr)45 ns
Speed500 ns, 200 mA
Supplier Device PackageTO-252
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]600 V
Voltage - Forward (Vf) (Max) @ If [Max]2.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.00
10$ 0.82
100$ 0.64
500$ 0.54
1000$ 0.44
Digi-Reel® 1$ 1.00
10$ 0.82
100$ 0.64
500$ 0.54
1000$ 0.44
N/A 9$ 1.01
Tape & Reel (TR) 2500$ 0.41
5000$ 0.40
12500$ 0.38
25000$ 0.38
MouserN/A 1$ 1.00
10$ 0.77
100$ 0.60
500$ 0.47
1000$ 0.43
2500$ 0.39
5000$ 0.38
NewarkEach (Supplied on Cut Tape) 1$ 1.04
10$ 0.80
25$ 0.74
50$ 0.68
100$ 0.62
250$ 0.56
500$ 0.49
1000$ 0.45

Description

General part information

RFV8BM6 Series

RFV8BM6SFH is the high reliability Automotive Fast Recovery Diode, suitable for general rectification.

Documents

Technical documentation and resources

RFV8BM6STL Datasheet (PDF)

Datasheet

Technical Data Sheet EN

Datasheet

Reliability Test Result

Manufacturing Data

Diode Types and Applications

Technical Article

Report of SVHC under REACH Regulation

Environmental Data

Taping Information

Package Information

Judgment Criteria of Thermal Evaluation

Thermal Design

About Export Regulations

Export Information

Power Loss and Thermal Design of Diodes

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Part Explanation

Application Note

About Flammability of Materials

Environmental Data

What Is Thermal Design

Thermal Design

Explanation for Marking

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Compliance of the RoHS directive

Environmental Data

List of Diode Package Thermal Resistance

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Package Dimensions

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Inner Structure

Package Information

How to Select Rectifier Diodes

Technical Article

What is a Thermal Model? (Diode)

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

ESD Data

Characteristics Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Anti-Whisker formation - Diodes

Package Information

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification