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BA17818FP-E2
Discrete Semiconductor Products

RFV8BM6SFHTL

Active
Rohm Semiconductor

AUTOMOTIVE FAST RECOVERY DIODE (AEC-Q101 QUALIFIED)

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsAbout Flammability of MaterialsPower Loss and Thermal Design of Diodes+31
BA17818FP-E2
Discrete Semiconductor Products

RFV8BM6SFHTL

Active
Rohm Semiconductor

AUTOMOTIVE FAST RECOVERY DIODE (AEC-Q101 QUALIFIED)

Deep-Dive with AI

DocumentsAbout Flammability of MaterialsPower Loss and Thermal Design of Diodes+31

Technical Specifications

Parameters and characteristics for this part

SpecificationRFV8BM6SFHTL
Current - Average Rectified (Io)8 A
Current - Reverse Leakage @ Vr10 µA
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction150 °C
Package / CaseSC-63, DPAK (2 Leads + Tab), TO-252-3
QualificationAEC-Q101
Reverse Recovery Time (trr)45 ns
Speed200 mA, 500 ns
Supplier Device PackageTO-252
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]600 V
Voltage - Forward (Vf) (Max) @ If [Max]2.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.01
10$ 1.28
100$ 0.87
500$ 0.69
1000$ 0.63
Digi-Reel® 1$ 2.01
10$ 1.28
100$ 0.87
500$ 0.69
1000$ 0.63
Tape & Reel (TR) 2500$ 0.57
5000$ 0.53
7500$ 0.53
NewarkEach (Supplied on Cut Tape) 1$ 1.47
10$ 1.05
25$ 0.97
50$ 0.90
100$ 0.82
250$ 0.76
500$ 0.70
1000$ 0.63

Description

General part information

RFV8BM6SFH Series

RFV8BM6SFH is the high reliability Automotive Fast Recovery Diode, suitable for general rectification.

Documents

Technical documentation and resources

About Flammability of Materials

Environmental Data

Power Loss and Thermal Design of Diodes

Thermal Design

Diode Types and Applications

Technical Article

Judgment Criteria of Thermal Evaluation

Thermal Design

Package Dimensions

Package Information

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Part Explanation

Application Note

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Select Rectifier Diodes

Technical Article

Constitution Materials List

Environmental Data

RFV8BM6SFH Data Sheet

Data Sheet

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

Reliability Test Result

Manufacturing Data

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Two-Resistor Model for Thermal Simulation

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

About Export Regulations

Export Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

List of Diode Package Thermal Resistance

Thermal Design

Explanation for Marking

Package Information

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

What Is Thermal Design

Thermal Design

Taping Information

Package Information

What is a Thermal Model? (Diode)

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification