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Integrated Circuits (ICs)

CSD97370Q5M

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Texas Instruments

30 V 25 A SON 5 X 6 MM SYNCHRONOUS BUCK NEXFET™ POWER STAGE

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22-SON-EP
Integrated Circuits (ICs)

CSD97370Q5M

Active
Texas Instruments

30 V 25 A SON 5 X 6 MM SYNCHRONOUS BUCK NEXFET™ POWER STAGE

Technical Specifications

Parameters and characteristics for this part

SpecificationCSD97370Q5M
ApplicationsSynchronous Buck Converters
Current - Output / Channel [custom]40 A
Current - Peak Output60 A
Fault ProtectionShoot-Through, UVLO
FeaturesBootstrap Circuit
InterfacePWM
Load TypeInductive
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-40 °C
Package / Case22-PowerLFDFN
Supplier Device Package22-LSON-CLIP (6x5)
TechnologyPower MOSFET
Voltage - Load [Max]22 V
Voltage - Load [Min]3.3 V
Voltage - Supply [Max]5.5 V
Voltage - Supply [Min]4.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 3.16
10$ 2.83
25$ 2.68
100$ 2.32
250$ 2.20
500$ 1.98
1000$ 1.67
Digi-Reel® 1$ 3.16
10$ 2.83
25$ 2.68
100$ 2.32
250$ 2.20
500$ 1.98
1000$ 1.67
Tape & Reel (TR) 2500$ 1.58
5000$ 1.52
Texas InstrumentsLARGE T&R 1$ 2.38
100$ 2.09
250$ 1.46
1000$ 1.18

Description

General part information

CSD97370Q5M Series

The CSD97370Q5M NexFET Power Stage is an optimized design for use in a high power, high density Synchronous Buck converter. This product integrates an enhanced gate driver IC and Power Block Technology to complete the power stage switching function. This combination produces a high current, high efficiency, high speed switching device and delivers an excellent thermal solution in a small 5-mm × 6-mm outline package due to its large ground based thermal pad. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

The CSD97370Q5M NexFET Power Stage is an optimized design for use in a high power, high density Synchronous Buck converter. This product integrates an enhanced gate driver IC and Power Block Technology to complete the power stage switching function. This combination produces a high current, high efficiency, high speed switching device and delivers an excellent thermal solution in a small 5-mm × 6-mm outline package due to its large ground based thermal pad. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.