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Audio Class D Analog Inp U-QFN2020-12 T&R 3K
Development Boards, Kits, Programmers

STEVAL-STWINMAV1

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STMicroelectronics

EXPANSION BOARD, STEVAL-STWINKT1 SENSORTILE WIRELESS INDUSTRIAL NODE DEV KIT, MICROPHONE ARRAY

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Audio Class D Analog Inp U-QFN2020-12 T&R 3K
Development Boards, Kits, Programmers

STEVAL-STWINMAV1

Active
STMicroelectronics

EXPANSION BOARD, STEVAL-STWINKT1 SENSORTILE WIRELESS INDUSTRIAL NODE DEV KIT, MICROPHONE ARRAY

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationSTEVAL-STWINMAV1
ContentsBoard(s)
TypeAudio
Utilized IC / PartMP23ABS1

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 1$ 21.65
NewarkEach 1$ 21.44

Description

General part information

STEVAL-STWINMAV1 Series

The STEVAL-STWINMAV1 microphone array expansion adds advanced audio sensing capabilities to the STEVAL-STWINKT1B (and STEVAL-STWINKT1) SensorTile Wireless Industrial Node (STWIN) kit for high frequency vibration monitoring applications.

The board includes four low-power, high signal-to-noise ratio (SNR) MP23ABS1 capacitive sensing microphones, supported by a very low drop voltage, low quiescent current and low-noise voltage regulator ideal for batter-powered applications such as STWIN.

The expansion board is connected via a dedicated 12-pin connector to the core system board, which runs the STSW-STWINKT01 firmware with dedicated BSP drivers and application examples for you to test and develop vibration monitoring in the ultrasound frequency ranges.