Connectors, Interconnects

550-10-361-18-101135

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Preci-Dip

PGA SOLDER TAIL

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Connectors, Interconnects

550-10-361-18-101135

Active

Preci-Dip

PGA SOLDER TAIL

Deep-Dive with AI

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	550-10-361-18-101135

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	0.25 µm
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	10 Áin
Contact Finish Thickness - Post	0.25 çm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Contact Resistance	10 mOhm
Current Rating (Amps)	1 A
Features	Open Frame
Housing Material	Polyester, Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	361
Number of Positions or Pins (Grid) [x]	18
Number of Positions or Pins (Grid) [y]	18
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 C
Pitch - Mating	1.27 mm
Pitch - Mating	0.05 in
Pitch - Post	0.05 in
Pitch - Post	1.27 mm
Termination	Solder
Termination Post Length [x]	3.2 mm
Termination Post Length [x]	0.126 in
Type	PGA

550-10 Series

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Contact Resistance	Material Flammability Rating	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Features	Operating Temperature [Min]	Operating Temperature [Max]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid)	Pitch - Mating	Pitch - Mating	Contact Material - Post [custom]	Termination	Mounting Type	Contact Finish - Mating	Housing Material	Pitch - Post	Pitch - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Type	Termination Post Length [x]	Termination Post Length [x]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]
Preci-Dip 550-10-256M20-001152	2.2 mm	0.086 in	1 A	10 mOhm	UL94 V-0	Brass	0.25 µm	10 µin	Closed Frame	-55 C	125 °C	20	20	256	1.27 mm	0.05 in	Brass	Solder	Through Hole	Gold	FR4 Epoxy Glass	0.05 in	1.27 mm	10 Áin	0.25 çm	Gold	BGA
Preci-Dip 550-10-361-18-101135			1 A	10 mOhm	UL94 V-0	Beryllium Copper	0.25 µm	10 µin	Open Frame	-55 C	125 °C	18	18	361	1.27 mm	0.05 in	Brass	Solder	Through Hole	Gold	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	0.05 in	1.27 mm	10 Áin	0.25 çm	Gold	PGA	3.2 mm	0.126 in
Preci-Dip 550-10-381-18-101135			1 A	10 mOhm	UL94 V-0	Beryllium Copper	0.25 µm	10 µin	Open Frame	-55 C	125 °C			381	1.27 mm	0.05 in	Brass	Solder	Through Hole	Gold	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	0.05 in	1.27 mm	10 Áin	0.25 çm	Gold	PGA	3.2 mm	0.126 in
Preci-Dip 550-10-068-10-061101	4.16 mm	0.164 in	1 A	10 mOhm	UL94 V-0	Beryllium Copper	0.25 µm	10 µin	Open Frame	-55 C	125 °C	10	10	68	2.54 mm	0.1 "	Brass	Solder	Through Hole	Gold	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	0.1 in	2.54 mm	10 Áin	0.25 çm	Gold	PGA
Preci-Dip 550-10-272M20-001166	2.5 mm	0.098 in	1 A	10 mOhm	UL94 V-0	Beryllium Copper	0.25 µm	10 µin	Closed Frame	-55 C	125 °C			272	1.27 mm	0.05 in	Brass	Solder	Through Hole	Gold	FR4 Epoxy Glass	0.05 in	1.27 mm	10 Áin	0.25 çm	Gold	BGA			20 x 20
Preci-Dip 550-10-520M31-001152	2.2 mm	0.086 in	1 A	10 mOhm	UL94 V-0	Brass	0.25 µm	10 µin	Closed Frame	-55 C	125 °C	31	31	520	1.27 mm	0.05 in	Brass	Solder	Through Hole	Gold	FR4 Epoxy Glass	0.05 in	1.27 mm	10 Áin	0.25 çm	Gold	BGA
Preci-Dip 550-10-272M20-001152	2.2 mm	0.086 in	1 A	10 mOhm	UL94 V-0	Brass	0.25 µm	10 µin	Closed Frame	-55 C	125 °C			272	1.27 mm	0.05 in	Brass	Solder	Through Hole	Gold	FR4 Epoxy Glass	0.05 in	1.27 mm	10 Áin	0.25 çm	Gold	BGA			20 x 20
Preci-Dip 550-10-037-10-061101	4.16 mm	0.164 in	1 A	10 mOhm	UL94 V-0	Beryllium Copper	0.25 µm	10 µin	Open Frame	-55 C	125 °C	10	10	37	2.54 mm	0.1 "	Brass	Solder	Through Hole	Gold	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	0.1 in	2.54 mm	10 Áin	0.25 çm	Gold	PGA
Preci-Dip 550-10-504M29-001152	2.2 mm	0.086 in	1 A	10 mOhm	UL94 V-0	Brass	0.25 µm	10 µin	Closed Frame	-55 C	125 °C	29	29	504	1.27 mm	0.05 in	Brass	Solder	Through Hole	Gold	FR4 Epoxy Glass	0.05 in	1.27 mm	10 Áin	0.25 çm	Gold	BGA
Preci-Dip 550-10-100-15-001101	4.16 mm	0.164 in	1 A	10 mOhm	UL94 V-0	Beryllium Copper	0.25 µm	10 µin	Open Frame	-55 C	125 °C	15	15		2.54 mm	0.1 "	Brass	Solder	Through Hole	Gold	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	0.1 in	2.54 mm	10 Áin	0.25 çm	Gold	PGA				100

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	11	$ 94.44
	N/A	0	$ 93.44

Description

General part information

550-10 Series

361 (18 x 18) Pos PGA Socket Gold Through Hole

Documents

Technical documentation and resources

No documents available