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Technical Specifications
Parameters and characteristics for this part
| Specification | 550-10-256M20-001152 |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 0.25 µm |
| Contact Finish Thickness - Mating | 10 µin |
| Contact Finish Thickness - Post | 10 Áin |
| Contact Finish Thickness - Post | 0.25 çm |
| Contact Material - Mating | Brass |
| Contact Material - Post [custom] | Brass |
| Contact Resistance | 10 mOhm |
| Current Rating (Amps) | 1 A |
| Features | Closed Frame |
| Housing Material | FR4 Epoxy Glass |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 256 |
| Number of Positions or Pins (Grid) [x] | 20 |
| Number of Positions or Pins (Grid) [y] | 20 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 C |
| Pitch - Mating | 1.27 mm |
| Pitch - Mating | 0.05 in |
| Pitch - Post | 0.05 in |
| Pitch - Post | 1.27 mm |
| Termination | Solder |
| Termination Post Length | 2.2 mm |
| Termination Post Length | 0.086 in |
| Type | BGA |
| Part | Termination Post Length | Termination Post Length | Current Rating (Amps) | Contact Resistance | Material Flammability Rating | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Features | Operating Temperature [Min] | Operating Temperature [Max] | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) [x] | Number of Positions or Pins (Grid) | Pitch - Mating | Pitch - Mating | Contact Material - Post [custom] | Termination | Mounting Type | Contact Finish - Mating | Housing Material | Pitch - Post | Pitch - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Post | Type | Termination Post Length [x] | Termination Post Length [x] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Preci-Dip | 2.2 mm | 0.086 in | 1 A | 10 mOhm | UL94 V-0 | Brass | 0.25 µm | 10 µin | Closed Frame | -55 C | 125 °C | 20 | 20 | 256 | 1.27 mm | 0.05 in | Brass | Solder | Through Hole | Gold | FR4 Epoxy Glass | 0.05 in | 1.27 mm | 10 Áin | 0.25 çm | Gold | BGA | ||||
Preci-Dip | 1 A | 10 mOhm | UL94 V-0 | Beryllium Copper | 0.25 µm | 10 µin | Open Frame | -55 C | 125 °C | 18 | 18 | 361 | 1.27 mm | 0.05 in | Brass | Solder | Through Hole | Gold | Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 0.05 in | 1.27 mm | 10 Áin | 0.25 çm | Gold | PGA | 3.2 mm | 0.126 in | ||||
Preci-Dip | 1 A | 10 mOhm | UL94 V-0 | Beryllium Copper | 0.25 µm | 10 µin | Open Frame | -55 C | 125 °C | 381 | 1.27 mm | 0.05 in | Brass | Solder | Through Hole | Gold | Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 0.05 in | 1.27 mm | 10 Áin | 0.25 çm | Gold | PGA | 3.2 mm | 0.126 in | ||||||
Preci-Dip | 4.16 mm | 0.164 in | 1 A | 10 mOhm | UL94 V-0 | Beryllium Copper | 0.25 µm | 10 µin | Open Frame | -55 C | 125 °C | 10 | 10 | 68 | 2.54 mm | 0.1 " | Brass | Solder | Through Hole | Gold | Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 0.1 in | 2.54 mm | 10 Áin | 0.25 çm | Gold | PGA | ||||
Preci-Dip | 2.5 mm | 0.098 in | 1 A | 10 mOhm | UL94 V-0 | Beryllium Copper | 0.25 µm | 10 µin | Closed Frame | -55 C | 125 °C | 272 | 1.27 mm | 0.05 in | Brass | Solder | Through Hole | Gold | FR4 Epoxy Glass | 0.05 in | 1.27 mm | 10 Áin | 0.25 çm | Gold | BGA | 20 x 20 | |||||
Preci-Dip | 2.2 mm | 0.086 in | 1 A | 10 mOhm | UL94 V-0 | Brass | 0.25 µm | 10 µin | Closed Frame | -55 C | 125 °C | 31 | 31 | 520 | 1.27 mm | 0.05 in | Brass | Solder | Through Hole | Gold | FR4 Epoxy Glass | 0.05 in | 1.27 mm | 10 Áin | 0.25 çm | Gold | BGA | ||||
Preci-Dip | 2.2 mm | 0.086 in | 1 A | 10 mOhm | UL94 V-0 | Brass | 0.25 µm | 10 µin | Closed Frame | -55 C | 125 °C | 272 | 1.27 mm | 0.05 in | Brass | Solder | Through Hole | Gold | FR4 Epoxy Glass | 0.05 in | 1.27 mm | 10 Áin | 0.25 çm | Gold | BGA | 20 x 20 | |||||
Preci-Dip | 4.16 mm | 0.164 in | 1 A | 10 mOhm | UL94 V-0 | Beryllium Copper | 0.25 µm | 10 µin | Open Frame | -55 C | 125 °C | 10 | 10 | 37 | 2.54 mm | 0.1 " | Brass | Solder | Through Hole | Gold | Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 0.1 in | 2.54 mm | 10 Áin | 0.25 çm | Gold | PGA | ||||
Preci-Dip | 2.2 mm | 0.086 in | 1 A | 10 mOhm | UL94 V-0 | Brass | 0.25 µm | 10 µin | Closed Frame | -55 C | 125 °C | 29 | 29 | 504 | 1.27 mm | 0.05 in | Brass | Solder | Through Hole | Gold | FR4 Epoxy Glass | 0.05 in | 1.27 mm | 10 Áin | 0.25 çm | Gold | BGA | ||||
Preci-Dip | 4.16 mm | 0.164 in | 1 A | 10 mOhm | UL94 V-0 | Beryllium Copper | 0.25 µm | 10 µin | Open Frame | -55 C | 125 °C | 15 | 15 | 2.54 mm | 0.1 " | Brass | Solder | Through Hole | Gold | Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 0.1 in | 2.54 mm | 10 Áin | 0.25 çm | Gold | PGA | 100 |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 648 | $ 33.98 | |
| N/A | 0 | $ 121.45 | ||
Description
General part information
550-10 Series
256 (20 x 20) Pos BGA Socket Gold Through Hole
Documents
Technical documentation and resources
No documents available