Integrated Circuits (ICs)

R8A774B0HA01BG#G0

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IC MPU RZ/G2N 1.5GHZ 1022FPBGA

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Integrated Circuits (ICs)

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IC MPU RZ/G2N 1.5GHZ 1022FPBGA

Technical Specifications

Parameters and characteristics for this part

Specification	R8A774B0HA01BG#G0

Additional Interfaces	I2C, SCI, CAN, SPI
Core Processor	ARM® Cortex®-A57
Display & Interface Controllers	DU
Ethernet	1000 Mbps, 100 Mbps, 10 Mbps
Graphics Acceleration	False
Mounting Type	Surface Mount
Number of Cores/Bus Width	64 Bit, 2 Core
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Package / Case	1022-BGA
RAM Controllers	LPDDR4
Speed	1.5 GHz
Supplier Device Package	1022-FPBGA
USB	USB (2)
Voltage - I/O	1.8 V, 3.3 V, 0.82 V

Part	Co-Processors/DSP	Number of Cores/Bus Width	Operating Temperature [Max]	Operating Temperature [Min]	Additional Interfaces	Core Processor	Display & Interface Controllers	Supplier Device Package	USB [custom]	Speed	RAM Controllers	Ethernet	Package / Case	Mounting Type	Voltage - I/O	USB	Number of Cores/Bus Width	Speed
Renesas Electronics Corporation R8A774C0HA01BG#G0	Multimedia NEON™ MPE	2 Core 64 Bit	85 °C	-40 °C	CAN I2C MMC/SD/SDIO SCI SCI FIFO SPDIF SPI SSI	ARM® Cortex®-A53	MIPI-CSI	552-FBGA (21x21)	USB 2.0 (1) USB 3.0 (1)	1.2 GHz	DDR3L	10 Mbps 100 Mbps 1000 Mbps	552-FBGA	Surface Mount
Renesas Electronics Corporation R8A774B0HA01BG#G0		2 Core 64 Bit	85 °C	-40 °C	CAN I2C SCI SPI	ARM® Cortex®-A57	DU	1022-FPBGA		1.5 GHz	LPDDR4	10 Mbps 100 Mbps 1000 Mbps	1022-BGA	Surface Mount	0.82 V 1.8 V 3.3 V	USB (2)
Renesas Electronics Corporation R8A774A0HA01BG#G2		6	85 °C	-40 °C	CAN I2C SCI SPI	ARM® Cortex®-A53 ARM® Cortex®-A57	DU	1022-FPBGA (29x29)		1.2 GHz	LPDDR4	10 Mbps 100 Mbps 1000 Mbps	1022-BGA	Surface Mount	0.82 V 1.8 V 3.3 V	USB (2)	64-Bit	1.5 GHz

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

ARM® Cortex®-A57 Microprocessor IC RZ/G2N 2 Core, 64-Bit 1.5GHz 1022-FPBGA

Technical documentation and resources

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