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VQFN-CLIP (RWJ)
Integrated Circuits (ICs)

CSD96416RWJ

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Texas Instruments

50-A PEAK CONTINUOUS CURRENT SYNCHRONOUS BUCK NEXFET™ SMART POWER STAGE

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VQFN-CLIP (RWJ)
Integrated Circuits (ICs)

CSD96416RWJ

Active
Texas Instruments

50-A PEAK CONTINUOUS CURRENT SYNCHRONOUS BUCK NEXFET™ SMART POWER STAGE

Technical Specifications

Parameters and characteristics for this part

SpecificationCSD96416RWJ
ApplicationsSynchronous Buck Converters
Current - Output / Channel30 A
Current - Peak Output50 A
Fault ProtectionShoot-Through
FeaturesBootstrap Circuit
InterfacePWM
Load TypeInductive
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-55 °C
Package / Case41-PowerTFQFN
Supplier Device Package41-VQFN-CLIP
TechnologyPower MOSFET
Voltage - Load25 V
Voltage - Supply16 VDC

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 2500$ 2.20
Texas InstrumentsLARGE T&R 1$ 3.56
100$ 3.12
250$ 2.18
1000$ 1.76

Description

General part information

CSD96416 Series

The CSD96416 NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm package. This power stage has an adjusted deadtime trim to improve transient response with non-TI controller. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

The CSD96416 NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm package. This power stage has an adjusted deadtime trim to improve transient response with non-TI controller. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.