CSD96416 Series

50-A peak continuous current synchronous buck NexFET™ smart power stage

Catalog

50-A peak continuous current synchronous buck NexFET™ smart power stage

Part	Current - Peak Output	Technology	Load Type	Mounting Type	Applications	Interface	Voltage - Load	Supplier Device Package	Features	Voltage - Supply	Package / Case	Current - Output / Channel	Fault Protection	Operating Temperature [Min]	Operating Temperature [Max]
Texas Instruments CSD96416RWJ	50 A	Power MOSFET	Inductive	Surface Mount	Synchronous Buck Converters	PWM	25 V	41-VQFN-CLIP	Bootstrap Circuit	16 VDC	41-PowerTFQFN	30 A	Shoot-Through	-55 °C	150 °C
Texas Instruments CSD96416RWJT	50 A	Power MOSFET	Inductive	Surface Mount	Synchronous Buck Converters	PWM	25 V	41-VQFN-CLIP	Bootstrap Circuit	16 VDC	41-PowerTFQFN	30 A	Shoot-Through	-55 °C	150 °C

Catalog

50-A peak continuous current synchronous buck NexFET™ smart power stage

Key Features

• Peak current rating: 50 A16-V VIN, 25-V high-side and low-side FETAdjusted deadtime trim to improve transient response with non-TI controllerPeak efficiency (fSW= 600 kHz, LOUT= 150 nH): over 94%High-frequency operation (up to 1.75 MHz)Temperature compensated bi-directional current senseAnalog temperature outputFault monitoring3.3-V and 5-V PWM signal compatibleTri-state PWM inputIntegrated bootstrap switchOptimized dead-time for shoot-through protectionHigh-density, QFN 5-mm × 6-mm footprintUltra-low-inductance packageSystem optimized PCB footprintThermally enhanced topside coolingRoHS compliant, lead-free terminal platingHalogen freePeak current rating: 50 A16-V VIN, 25-V high-side and low-side FETAdjusted deadtime trim to improve transient response with non-TI controllerPeak efficiency (fSW= 600 kHz, LOUT= 150 nH): over 94%High-frequency operation (up to 1.75 MHz)Temperature compensated bi-directional current senseAnalog temperature outputFault monitoring3.3-V and 5-V PWM signal compatibleTri-state PWM inputIntegrated bootstrap switchOptimized dead-time for shoot-through protectionHigh-density, QFN 5-mm × 6-mm footprintUltra-low-inductance packageSystem optimized PCB footprintThermally enhanced topside coolingRoHS compliant, lead-free terminal platingHalogen free

Description

The CSD96416 NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm package. This power stage has an adjusted deadtime trim to improve transient response with non-TI controller. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design. The CSD96416 NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm package. This power stage has an adjusted deadtime trim to improve transient response with non-TI controller. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.