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Discrete Semiconductor Products

R6030ENZ4C13

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Rohm Semiconductor

600V 30A TO-247, LOW-NOISE POWER MOSFET

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Product dimension image
Discrete Semiconductor Products

R6030ENZ4C13

Active
Rohm Semiconductor

600V 30A TO-247, LOW-NOISE POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationR6030ENZ4C13
Current - Continuous Drain (Id) @ 25°C30 A
Drain to Source Voltage (Vdss)600 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]85 nC
Input Capacitance (Ciss) (Max) @ Vds2100 pF
Mounting TypeThrough Hole
Operating Temperature150 °C
Package / CaseTO-247-3
Power Dissipation (Max)305 W
Rds On (Max) @ Id, Vgs130 mOhm
Supplier Device PackageTO-247
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 11$ 9.62
NewarkEach 1$ 9.59
10$ 9.05
25$ 6.76
50$ 6.35
100$ 5.95
250$ 5.00

Description

General part information

R6030ENZ4 Series

R6030ENZ4 is a power MOSFET for switching applications.

Documents

Technical documentation and resources

How to Create Symbols for PSpice Models

Models

About Flammability of Materials

Environmental Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Types and Features of Transistors

Application Note

Package Dimensions

Package Information

Anti-Whisker formation - Transistors

Package Information

TO247AD Explanation for Marking

Package Information

R6030ENZ4 Data Sheet

Data Sheet

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Moisture Sensitivity Level - Transistors

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

About Export Regulations

Export Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

List of Transistor Package Thermal Resistance

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Compliance of the RoHS directive

Environmental Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Part Explanation

Application Note

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

R6030ENZ4 ESD Data

Characteristics Data

What Is Thermal Design

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Technical Data Sheet EN

Datasheet