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Technical Specifications
Parameters and characteristics for this part
| Specification | LE87100NQCT |
|---|---|
| -3db Bandwidth | 180 MHz |
| Amplifier Type | Current Feedback |
| Current - Output / Channel | 400 mA |
| Current - Supply | 16 mA |
| Gain Bandwidth Product | 100 MHz |
| Mounting Type | Surface Mount |
| Number of Circuits | 2 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Output Type | Single-Ended |
| Package / Case | 16-VQFN Exposed Pad |
| Slew Rate | 1200 V/µs |
| Supplier Device Package | 16-QFN (4x4) |
| Voltage - Supply Span (Max) [Max] | 12 V |
| Voltage - Supply Span (Min) [Min] | 8 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 2.22 | |
| 25 | $ 1.87 | |||
| 100 | $ 1.79 | |||
| Digi-Reel® | 1 | $ 2.22 | ||
| 25 | $ 1.87 | |||
| 100 | $ 1.79 | |||
| Tape & Reel (TR) | 5000 | $ 1.79 | ||
| Microchip Direct | T/R | 1 | $ 2.22 | |
| 25 | $ 1.87 | |||
| 100 | $ 1.71 | |||
| 1000 | $ 1.55 | |||
| 5000 | $ 1.46 | |||
Description
General part information
LE87100 Series
The Le87100 device is a single-channel differential amplifier designed to drive PLC high-power signals. The Le87100 device contains a pair of wide-band amplifiers designed with Microchip’s HV15 bipolar SOI process for high-power output with low-power consumption. Line driver gain is set externally to the device. The device can be powered from a single high-voltage supply or from dual supplies. The device can be programmed to one of three preset bias levels to optimize power and performance. In addition, the line driver features a power down state, which forces low-power and high-impedance mode for receive transmissions or for idle operations. The control pins respond to input levels that can be generated with a standard GPIO, but are tolerant of higher voltage logic levels. The Le87100 device is available in a 16-pin (4 mm x 4 mm) QFN package with an exposed pad for enhanced thermal conductivity.
Documents
Technical documentation and resources