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TO-3PFM
Discrete Semiconductor Products

RGCL80TK60DGC11

Active
Rohm Semiconductor

LOW VCE(SAT)TYPE, 600V 40A, FRD BUILT-IN, TO-3PFM, FIELD STOP TRENCH IGBT

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TO-3PFM
Discrete Semiconductor Products

RGCL80TK60DGC11

Active
Rohm Semiconductor

LOW VCE(SAT)TYPE, 600V 40A, FRD BUILT-IN, TO-3PFM, FIELD STOP TRENCH IGBT

Technical Specifications

Parameters and characteristics for this part

SpecificationRGCL80TK60DGC11
Current - Collector (Ic) (Max) [Max]35 A
Gate Charge98 nC
IGBT TypeTrench Field Stop
Mounting TypeThrough Hole
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 C
Package / CaseTO-3PFM, SC-93-3
Power - Max [Max]57 W
Reverse Recovery Time (trr)58 ns
Supplier Device PackageTO-3PFM
Switching Energy1.68 mJ, 1.11 mJ
Td (on/off) @ 25°C53 ns, 227 ns
Test Condition10 Ohm, 40 A, 400 V, 15 V
Vce(on) (Max) @ Vge, Ic1.8 V
Voltage - Collector Emitter Breakdown (Max) [Max]600 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 1.87
30$ 1.50
120$ 1.23
510$ 1.11
NewarkEach 1$ 3.17
10$ 2.93
25$ 2.75

Description

General part information

RGCL80TK60D Series

ROHM's IGBT products will contribute to energy saving high efficiency and a wide range of high voltage and high-current applications.

Documents

Technical documentation and resources

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Explanation for Marking

Package Information

Moisture Sensitivity Level

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

RGCL80TK60D Data Sheet

Data Sheet

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Inner Structure

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Compliance of the ELV directive

Environmental Data

Types and Features of Transistors

Application Note

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Create Symbols for PSpice Models

Models

About Flammability of Materials

Environmental Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

PCB Layout Thermal Design Guide

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Package Dimensions

Package Information

Taping Information

Package Information

Reliability Test Result

Manufacturing Data

Judgment Criteria of Thermal Evaluation

Thermal Design

4 Steps for Successful Thermal Designing of Power Devices

White Paper

About Export Administration Regulations (EAR)

Export Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Anti-Whisker formation

Package Information

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

Two-Resistor Model for Thermal Simulation

Thermal Design

What Is Thermal Design

Thermal Design