Integrated Circuits (ICs)
DSPIC33EP256GP502T-E/SS
ObsoleteMicrochip Technology
IC MCU 16BIT 256KB FLASH 28SSOP
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Integrated Circuits (ICs)
DSPIC33EP256GP502T-E/SS
ObsoleteMicrochip Technology
IC MCU 16BIT 256KB FLASH 28SSOP
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DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | DSPIC33EP256GP502T-E/SS |
|---|---|
| Connectivity | IrDA, UART/USART, I2C, CANbus, SPI, LINbus |
| Core Processor | dsPIC |
| Core Size | 16-Bit |
| Data Converters | 6 channels |
| Data Converters [custom] | 12 b, 10 b |
| Grade | Automotive |
| Mounting Type | Surface Mount |
| Number of I/O | 21 I/O |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -40 °C |
| Oscillator Type | Internal |
| Package / Case | 28-SSOP |
| Package / Case [custom] | 0.209 in |
| Package / Case [custom] | 5.3 mm |
| Peripherals | Brown-out Detect/Reset, DMA, POR, WDT, PWM |
| Program Memory Size | 256 KB |
| Program Memory Type | FLASH |
| Qualification | AEC-Q100 |
| RAM Size | 16K x 16 |
| Speed | 60 MIPs |
| Supplier Device Package | 28-SSOP |
DSPIC33EP256GP502 Series
16-Bit DSC, Hi-Speed PWM, Op Amps, Adv Analog
| Part | Number of I/O | Speed | RAM Size | Oscillator Type | Mounting Type | Core Processor | Supplier Device Package | Data Converters | Data Converters [custom] | Core Size | Operating Temperature [Max] | Operating Temperature [Min] | Peripherals | Connectivity | Program Memory Size | Package / Case | Package / Case [x] | Package / Case [y] | Program Memory Type | Grade | Qualification | Package / Case | Package / Case | Package / Case [custom] | Package / Case [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Microchip Technology | 21 I/O | 70 MIPs | 16K x 16 | Internal | Surface Mount | dsPIC | 28-SOIC | 6 channels | 10 b 12 b | 16-Bit | 85 °C | -40 °C | Brown-out Detect/Reset DMA POR PWM WDT | CANbus I2C IrDA LINbus SPI UART/USART | 256 KB | 28-SOIC | 0.295 in | 7.5 mm | FLASH | ||||||
 Microchip Technology | 21 I/O | 60 MIPs | 16K x 16 | Internal | Surface Mount | dsPIC | 28-QFN-S (6x6) | 6 channels | 10 b 12 b | 16-Bit | 150 °C | -40 °C | Brown-out Detect/Reset DMA POR PWM WDT | CANbus I2C IrDA LINbus SPI UART/USART | 256 KB | 28-VQFN Exposed Pad | FLASH | Automotive | AEC-Q100 | ||||||
 Microchip Technology | 21 I/O | 60 MIPs | 16K x 16 | Internal | Through Hole | dsPIC | 28-SPDIP | 6 channels | 10 b 12 b | 16-Bit | 125 °C | -40 °C | Brown-out Detect/Reset DMA POR PWM WDT | CANbus I2C IrDA LINbus SPI UART/USART | 256 KB | 28-DIP | FLASH | Automotive | AEC-Q100 | 0.3 in | 7.62 mm | ||||
Microchip Technology | 21 I/O | 60 MIPs | 16K x 16 | Internal | Surface Mount | dsPIC | 28-SSOP | 6 channels | 10 b 12 b | 16-Bit | 125 °C | -40 °C | Brown-out Detect/Reset DMA POR PWM WDT | CANbus I2C IrDA LINbus SPI UART/USART | 256 KB | 28-SSOP | FLASH | Automotive | AEC-Q100 | 0.209 in | 5.3 mm | ||||
Microchip Technology | 21 I/O | 70 MIPs | 16K x 16 | Internal | Surface Mount | dsPIC | 28-QFN-S (6x6) | 6 channels | 10 b 12 b | 16-Bit | 85 °C | -40 °C | Brown-out Detect/Reset DMA POR PWM WDT | CANbus I2C IrDA LINbus SPI UART/USART | 256 KB | 28-VQFN Exposed Pad | FLASH | ||||||||
 Microchip Technology | 21 I/O | 70 MIPs | 16K x 16 | Internal | Surface Mount | dsPIC | 28-QFN-S (6x6) | 6 channels | 10 b 12 b | 16-Bit | 85 °C | -40 °C | Brown-out Detect/Reset DMA POR PWM WDT | CANbus I2C IrDA LINbus SPI UART/USART | 256 KB | 28-VQFN Exposed Pad | FLASH | ||||||||
 Microchip Technology | 21 I/O | 60 MIPs | 16K x 16 | Internal | Surface Mount | dsPIC | 28-QFN-S (6x6) | 6 channels | 10 b 12 b | 16-Bit | 125 °C | -40 °C | Brown-out Detect/Reset DMA POR PWM WDT | CANbus I2C IrDA LINbus SPI UART/USART | 256 KB | 28-VQFN Exposed Pad | FLASH | Automotive | AEC-Q100 | ||||||
Microchip Technology | 21 I/O | 60 MIPs | 16K x 16 | Internal | Surface Mount | dsPIC | 28-SOIC | 6 channels | 10 b 12 b | 16-Bit | 125 °C | -40 °C | Brown-out Detect/Reset DMA POR PWM WDT | CANbus I2C IrDA LINbus SPI UART/USART | 256 KB | 28-SOIC | 0.295 in | 7.5 mm | FLASH | Automotive | AEC-Q100 | ||||
Microchip Technology | 21 I/O | 60 MIPs | 16K x 16 | Internal | Surface Mount | dsPIC | 28-QFN-S (6x6) | 6 channels | 10 b 12 b | 16-Bit | 125 °C | -40 °C | Brown-out Detect/Reset DMA POR PWM WDT | CANbus I2C IrDA LINbus SPI UART/USART | 256 KB | 28-VQFN Exposed Pad | FLASH | Automotive | AEC-Q100 | ||||||
 Microchip Technology | 21 I/O | 70 MIPs | 16K x 16 | Internal | Through Hole | dsPIC | 28-SPDIP | 6 channels | 10 b 12 b | 16-Bit | 85 °C | -40 °C | Brown-out Detect/Reset DMA POR PWM WDT | CANbus I2C IrDA LINbus SPI UART/USART | 256 KB | 28-DIP | FLASH | 0.3 in | 7.62 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
Description
General part information
DSPIC33EP256GP502 Series
Microchip’s dsPIC33E general purpose DSC family features the highest speed 70 MIPS core with excellent performance and code density. It offers superior ADC performance, enhanced CAN communication, CTMU, Op Amps and Peripheral Trigger Generator (PTG) for high-end general purpose applications. These devices are available in various packages and with an extended (125°C) temp option.
Documents
Technical documentation and resources