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Discrete Semiconductor Products

R6025JNZC17

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Rohm Semiconductor

600V 25A TO-3PF, PRESTOMOS™ WITH INTEGRATED HIGH-SPEED DIODE

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Product thumbnail image
Discrete Semiconductor Products

R6025JNZC17

Active
Rohm Semiconductor

600V 25A TO-3PF, PRESTOMOS™ WITH INTEGRATED HIGH-SPEED DIODE

Technical Specifications

Parameters and characteristics for this part

SpecificationR6025JNZC17
Current - Continuous Drain (Id) @ 25°C25 A
Drain to Source Voltage (Vdss)600 V
Drive Voltage (Max Rds On, Min Rds On)15 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs57 nC
Input Capacitance (Ciss) (Max) @ Vds1900 pF
Mounting TypeThrough Hole
Operating Temperature150 °C
Package / CaseTO-3P-3 Full Pack
Power Dissipation (Max) [Max]85 W
Rds On (Max) @ Id, Vgs182 mOhm
Supplier Device PackageTO-3PF
TechnologyMOSFET (Metal Oxide)
Vgs (Max)30 V
Vgs(th) (Max) @ Id7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBag 1$ 8.36
10$ 5.70
300$ 3.72
600$ 3.60
NewarkEach 1$ 7.05
10$ 4.80
25$ 4.61
50$ 4.41
100$ 4.21
250$ 4.01
600$ 3.82

Description

General part information

R6025JNZ4 Series

R6025JNZ4 is a power MOSFET with fast reverse recovery time (trr), suitable for the switching applications.PrestoMOS™ series, R60xxJNx series increases design flexibility while maintaining the industry’s fastest reverse recovery time (trr) optimized for EV charging stations and motor drive in home appliances such as refrigerators and Air Conditioners (ACs).

Documents

Technical documentation and resources

Method for Monitoring Switching Waveform

Schematic Design & Verification

Types and Features of Transistors

Application Note

About Export Regulations

Export Information

Double-pulse test substantiated advantages of PrestoMOS™

Technical Article

Two-Resistor Model for Thermal Simulation

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Reliability Test Result

Manufacturing Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

What Is Thermal Design

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Inner Structure

Package Information

Report of SVHC under REACH Regulation

Environmental Data

How to Create Symbols for PSpice Models

Models

Benefits given by PrestoMOS™ series for the Phase-Shift Full-Bridge

Technical Article

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

R6025JNZ Data Sheet

Data Sheet

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

About Flammability of Materials

Environmental Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Part Explanation

Application Note

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design